SERIES
MATERIAL NUMBER
CUSTOMER
GENERAL MARKET
41792
SEE CHART
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
SHEET NUMBER
1 OF *
GENERAL TOLERANCES
(UNLESS SPECIFIED)
MM
INCH
4 PLACES
± ±
3 PLACES
± ±
0.01
2 PLACES
±
0.25
±
0.015
1 PLACES
±
0.38
±
0 PLACES
± ±
ANGULAR TOL
±
0.5
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
DIMENSION UNITS SCALE
MM/IN
2:1
DRWN BY DATE
JSCHAFER
11-07-03
CHK'D BY
DATE
KSAMIEC
11-10-03
APPR BY DATE
MARGULIS
11-17-03
DOCUMENT NUMBER
DOC TYPE
DOC PART
SDA-41792 PSD
000
DRAWING SIZE
THIRD ANGLE PROJECTION
B
KK .156 HEADER ASSEMBLY
FRICTION LOCK RIGHT ANGLE W/O PEGS
PRODUCT CUSTOMER DRAWING
ADD 41792-0704
2017/01/10
2017/01/19
2017/01/30
112230
MKIPPER
JDFOX
FSMITH
EC NO:
DRWN:
CHK'D:
APPR:
K4
REV
QUALITY
SYMBOLS
=
0
=
0
=
0
=
0
=
0
=
0
=
0
=
0
FORMAT: Eng-lega-master-tb-prod-B
REVISION: C
DATE: 2016/04/04
RELEASE STATUS RELEASE DATE
C
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
NONE
D
18
15.70
.618
6 & 7
12 & 13
DIM. B
TYP. BETWEEN ANY
2 CONSECUTIVE
CIRCUITS
AT DATUM -D-
5 & 6
11 & 12
67.21
2.646
5 & 6
10 & 11
CENTERLINE OF PIN AT TIP
NOT TO VARY FROM CENTERLINE OF
PIN AT DATUM -D- BY MORE THAN
0.20 / .008 IN ANY DIRECTION.
5 & 6
9 & 10
SLOT LOC
BETWEEN CKTS
63.25
2.490
55.32
2.178
6 & 7
11 & 12
59.28
2.334
SEE NOTE 9
4 & 5
4 & 5
5 & 6
3 & 4
5 & 6
NONE
6 & 7
NONE
4 & 5
8 & 9
NONE
CIRCUIT 1 REF.
SEE NOTE 10
4 & 5
9 & 10
OPTIONAL VOIDED CIRCUIT
SEE CHART FOR LOCATIONS
6
10
12
3
11
2
4
8
5
9
17
67.36
±
0.20
2.652
±
.008
14
13
15
16
7
.067
±
.002
NOTES:
1. MATERIAL: HEADER-GLASS FILLED POLYESTER, 94V-0, MOLDED NATURAL (WHITE).
2. FINISH: (197) OVERALL REFLOWED MATTE TIN: 0.00152/.000060 MIN.
OVER 0.00127/.000050 MIN. NICKEL OVERALL.
(154) OVERALL TIN: .00254/.000100 MIN OVER .00127/.000050 MIN NICKEL.
(208) SELECT GOLD: .00038/.000015 MIN, SELECT TIN: .00254/.000100 MIN,
OVERALL NICKEL UNDERPLATE: .00127/.000050 MIN.
(228) SELECT GOLD: .00076/.000030 MIN, SELECT TIN: .00254/.000100 MIN,
OVERALL NICKEL UNDERPLATE: .00127/.000050 MIN.
(241) SELECT GOLD: 0.00051/.000020 MIN.
SELECT TIN: 0.00254/.000100 MIN.
OVERALL NICKEL UNDERPLATE: 0.00127/.000050 MIN.
FOR ADDITIONAL PLATING INFO, SEE SDES-88.
3. PRODUCT SPECIFICATION AND PROCESS PARAMETERS: SEE PS-08-50.
4. PACKAGING INFORMATION: SEE CHART
5. SOLDERABILITY: PER SMES-152.
6. PIN PUSH-OUT FORCE: PRIOR TO SOLDERING, A 3 LB. MINIMUM FORCE (IN EITHER DIRECTION)
7. PARTS ARE STACKABLE END TO END ON 3.96/.156 CENTERS.
8. THIS PART CONFORMS TO CLASS B REQUIREMENTS OF COSMETIC SPECIFICATION PS-45499-002.
9. SLOTS ON BACKWALL ARE BETWEEN CIRCUITS. SEE CHART FOR LOCATION.
10. CIRCUIT 1 DESIGNATION IS USED TO DEFINE VOID LOCATION. CIRCUIT 1 MAY OR MAY NOT LINE UP
WITH CIRCUIT 1 ON THE MATING HOUSING.
3.96
±
0.05
.394
±
.020
TYP NON-ACCUM.
10.01
±
0.51
DIA TYP
±
0.25
±
.010
±
0.38
±
.015
REF.
PCB LAYOUT: COMPONENT SIDE
P
TYP
.095
REF
M
2.41
.201
TYP
.446
±
.020
5.11
GOLD
11.33
±
0.51
TIN
3.96REF.
.130
3.30
.156
±
.002
DIM. A REF.
1.70
±
0.05
.156
Y
CENTERLINE OF PIN AT TIP
NOT TO VARY FROM CENTERLINE OF
PIN AT DATUM -D- BY MORE THAN
0.20 / .008 IN ANY DIRECTION.
31.55
1.242
19.66
.774
27.58
1.086
51.36
2.022
43.43
1.710
CKT
DIM. A
DIM. B
3.96
±
0.05
.156
±
.002
47.40
1.866
39.47
1.554
35.51
1.398
23.62
.930
7.77
.306
7.92
±
0.08
.312
±
.003
15.85
±
0.10
.624
±
.004
19.81
±
0.10
.780
±
.004
11.89
±
0.08
.468
±
.003
23.77
±
0.10
.936
±
.004
31.70
±
0.13
1.248
±
.005
27.74
±
0.13
1.092
±
.005
35.66
±
0.13
1.404
±
.005
39.62
±
0.15
1.560
±
.006
43.59
±
0.15
1.716
±
.006
47.55
±
0.15
1.872
±
.006
55.47
±
0.18
2.184
±
.007
51.51
±
0.18
2.028
±
.007
59.44
±
0.18
2.340
±
.007
71.17
2.802
63.40
±
0.20
2.496
±
.008
11.73
.462
Model: EM-41792 (SD Package)
