VR25, VR37, VR68
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Vishay BCcomponents
Revision: 25-Sep-15
7
Document Number: 28907
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TESTS PROCEDURES AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
• IEC 60115-1, generic specification (includes tests)
The test and requirements table contains only the most
important tests. For the full test schedule refer to the
documents listed above.
The tests are carried out with reference to IEC 60115-1, in
accordance with IEC 60068-2-xx test method and under
standard atmospheric conditions in accordance with
IEC 60068-1, 5.3.
A climatic category 55 / 155 / 56 is applied, defined by the
lower category temperature (LCT = -55 °C), the upper
category temperature (UCT = 155 °C), and the duration
of exposure in the damp heat, steady state test (56 days).
Unless otherwise specified the following values apply:
• Temperature: 15 °C to 35 °C
• Relative humidity: 45 % to 75 %
• Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
For performing some of the tests, the components are
mounted on a test board in accordance with IEC 60115-1,
4.31.
In test procedures and requirements table, only the tests
and requirements are listed with reference to the relevant
clauses of IEC 60115-1 and IEC 60068-2-xx test methods.
A short description of the test procedure is also given.
TESTS PROCEDURES AND REQUIREMENTS
IEC 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
(R
max.
)
4.6.1.1 Insulation resistance U
max.
DC = 500 V during 1 min; V-block method R
ins
min.: 10 000 M
4.7 Voltage proof U
RMS
= U
ins
; 60 s No breakdown or flashover
4.8 Temperature coefficient At (20 / -55 / 20) °C and (20 / 155 / 20) °C ± 200 ppm/K
4.12 Noise IEC 60195
VR25: max. 5 V/V
VR37: max. 2.5 V/V
VR68: max. 2.5 V/V
4.13 Short time overload
Room temperature; 2.5 x ;
(voltage not more than 2 x limiting voltage);
10 cycles; 5 s ON and 45 s OFF
R max.: ± 2 % R
4.16
21 (Ua1)
21 (Ub)
21 (Uc)
Robustness of
terminations
Tensile, bending, and torsion
No damage
R max.: ± 0.5 % R
4.17 20 (Ta) Solderability
+235 °C; 2 s; solder bath method; SnPb40
+245 °C; 3 s; solder bath method; SnAg3Cu0.5
(before aging)
Good tinning ( 95 % covered);
no damage
+235 °C; 2 s; solder bath method; SnPb40
+245 °C; 3 s; solder bath method; SnAg3Cu0.5
(after aging)
Good tinning ( 95 % covered);
no damage
4.18 20 (Tb)
Resistance to
soldering heat
Unmounted components
(260 ± 5) °C; (10 ± 1) s
R max.: ± 0.5 % R
4.19 14 (Na)
Rapid change
of temperature
30 min at -55 °C and 30 min at +155 °C;
5 cycles
R max.: ± 0.5 % R
4.20 29 (Eb) Bump 3 x 1500 bumps in 3 directions; 40 g
No damage
R max.: ± 0.5 % R
4.22 6 (Fc) Vibration
10 sweep cycles per direction;
10 Hz to 2000 Hz;
1.5 mm or 200 m/s
2
No damage
R max.: ± 0.5 % R
4.23 Climatic sequence:
R
ins
min.: 1 G
R max.: ± 1.5 % R
4.23.2 2 (Bb) Dry heat 16 h; 155 °C
4.23.3 30 (Db)
Damp heat
cyclic
24 h; 25 °C to 55 °C;
90 % to 100 % RH
4.23.4 1 (Ab) Cold 2 h; -55 °C
4.23.5 13 (M) Low air pressure
2 h; 8.5 kPa;
15 °C to 35 °C
4.23.6 30 (Db)
Damp heat
remaining cyclic
5 days; 55 °C;
95 % to 100 % RH; 5 cycles
4.23.7 DC load Apply rated power for 1 min
