96-7069-9540

Product Description
Kester 268 Flux-Cored Wire is a zero-halogen wire optimized for robotic soldering applications. With its unique chemistry
system, 268 provides consistent workability performance for both robotic and manual soldering in the electronics industry,
with performance equivalent to conventional halogen/ halide-based systems. 268 provides a clean release which
prevents occurrences of bridges and protrusions, even in narrow-pitch automated drag soldering. The use of 268 results
in a clear post-soldering residue without the need for cleaning. 268 is classied as Type ROL0 ux under J-STD-004B
specications. 268 is zero-halogen and halide-free with no intentional addition of bromine and chlorine, conforming to the
strictest requirements of IEC 61249-2-21, JPCA-ES-01 and IPC-410B specications.
Technical Data Sheet
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808
Website: www.kester.com
268 Flux-Cored Wire
Zero-Halogen, No-Clean Cored Wire for Robotic & Manual Soldering
®
Performance Characteristics:
Low occurrence of solder ball
spatter
Conforms to halogen-free
requirement of IEC 61249-2-21,
JPCA-ES-01 and IPC-410B speci-
cations with no intentionally added
halogens and halides
Low smoke and odor
Clear residue, resulting in excellent
joint aesthetics after soldering
Excellent surface wettability and
spreading suitable for robotic solder-
ing and manual soldering
Excellent manufacturing consistency
and uniform quality, minimizes de-
fects for all types of soldering
Excellent wetting speed and spread;
superior to halogenated materials
Classied as ROL0 per J-STD-004B
RoHS Compliance
This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4
for the stated banned substances. (Applies only if this core ux is combined with a lead-free alloy)
Reliability Properties
Copper Mirror Corrosion: Low
Tested to J-STD-004B, IPC-TM-650, Method
2.3.32
Corrosion Test: Low
Tested to J-STD-004B, IPC-TM-650, Method
2.6.15
Silver Chromate: Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.3.33
Quantitative Halides: None Detected
Tested to J-STD-004, IPC-TM-650, Method
2.3.28.1
Quantitative Halogens: None
Detected
Tested to IPC-TM-650, Method 2.3.35, JPCS-
ES-01, prEN14582 and IEC 61189-2 Test 2C12
specications
Surface Insulation Resistance (SIR)
40°C/90% RH, IPC (typical): Pass
Tested to J-STD-004B, IPC-TM-650, Method
2.6.3.7
Health and Safety
This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet
(SDS) and warning label before using this product.
Application Notes
Global Headquarters: 800 West Thorndale Avenue, Itasca, IL USA 60143 Phone: +1 800.2.KESTER Fax: +1 630.616.4044
Asia-Pacific Headquarters: 61 Ubi Avenue 1 #06-01 UB Point, Singapore 408941 Phone: +65 6.449.1133 Fax: +65 6.242.9036
European Headquarters: Ganghofer Strasse 45, 82216 Gernlinden, Germany Phone: +49 (0) 8142 4785 0 Fax: +49 (0) 8142 4785 61
Asia Manufacturing: Hengqiao Road, Wujiang Economic Development Zone Suzhou, Jiangsu Province, China 215200 Phone: +86 512.82060807 Fax: +86 512.8206 0808
Website: www.kester.com
®
Availability
268 is available in SAC 305 and K100LD lead-free alloys and Sn63Pb37 in 3.3% ux on a robotic spool. For low-cost,
lead-free soldering applications, the K100LD alloy is ideal. Wire diameters typically range from 0.25-1.6mm (0.010-
0.062in).
For other alloys and ux percentages, please contact Kester Customer Service. Please refer to www.kester.com for more
information.
Cleaning
268 possesses excellent uxing ability. The ux residues are non-corrosive, non-conductive, and do not require removal
for most applications under normal conditions of use. IPA will not clean the residues off the surface of the circuit board
after the soldering process. If removal is required, a saponier or cleaning agent specically designed to clean a no-clean
ux is required to clean the residues. Please contact Kester Technical Support for further information.
Process Considerations
Solder iron tip temperatures are most commonly between 371-400°C (700-750°F) for lead-free alloys and 315-343°C
(600-650°F) for leaded alloys. Heat both the land area and component lead to be soldered with the iron tip prior to
applying the solder wire to land area or component lead. To maximize tip life and reduce solder spattering, do not feed
wire directly to iron tip.
Additional liquid ux should only be used as a last resort. Any ux applied to the solder location should be kept to the
area of the connection being reworked. If needed, Kester NF372-TB may be used as a compatible liquid ux to aid in
enhancing solderability of soldered joints. NF372-TB is also available in as a Flux-Pen
®
for optimum board cleanliness.
Storage and Warranty Period
Storage must be in a dry, non-corrosive environment between 10-40°C (50-104°F). The surface may lose its shine and
appear a dull shade of grey. This is a surface phenomenon and is not detrimental to product functionality. Flux-cored
solder wire has a limited warranty period determined by the alloy used in the wire. For alloys containing more than 70%
lead, the warranty period is 2 years from the date of manufacture. Other alloys have a warranty period of 3 years from the
date of manufacture.

96-7069-9540

Mfr. #:
Manufacturer:
Kester
Description:
Solder SN96.5AG3.0CU0.5 3.3%/268
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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