10
0911G–EPROM–8/07
AT27LV520
19. Ordering Information
19.1 Standard Package
t
ACC
(ns)
I
CC
(mA)
Active Ordering Code Package Operation Range
70 8
AT27LV520-70SI
AT27LV520-70XI
20S
20X
Industrial
(-40°C to +85°C)
90 8
AT27LV520-90SI
AT27LV520-90XI
20S
20X
Industrial
(-40°C to +85°C)
19.2 Green Package (Pb/Halide-free)
t
ACC
(ns)
I
CC
(mA)
Active Ordering Code Package Operation Range
70 8
AT27LV520-70SU
AT27LV520-70XU
20S
20X
Industrial
(-40°C to +85°C)
90 8 AT27LV520-90XU 20X
Industrial
(-40°C to +85°C)
Package Type
20S
20-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
20X 20-lead, 4.4 mm Body Width, Plastic Thin Shrink Small Outline (TSSOP)
11
0911G–EPROM–8/07
AT27LV520
20. Packaging Information
20.1 20S – SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
20S, 20-lead, 0.300" Body, Plastic Gull Wing Small Outline (SOIC)
B
20S
10/23/03
7.60 (0.2992)
7.40 (0.2914)
0.51(0.020)
0.33(0.013)
10.65 (0.419)
10.00 (0.394)
PIN 1 ID
1.27 (0.050) BSC
13.00 (0.5118)
12.60 (0.4961)
0.30(0.0118)
0.10 (0.0040)
2.65 (0.1043)
2.35 (0.0926)
0º ~ 8º
1.27 (0.050)
0.40 (0.016)
0.32 (0.0125)
0.23 (0.0091)
PIN 1
Dimensions in Millimeters and (Inches).
Controlling dimension: Inches.
JEDEC Standard MS-013
12
0911G–EPROM–8/07
AT27LV520
20.2 20X – TSSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
20X, (Formerly 20T), 20-lead, 4.4 mm Body Width,
Plastic Thin Shrink Small Outline Package (TSSOP)
C
20X
10/23/03
6.60 (.260)
6.40 (.252)
1.20 (0.047) MAX
0.65 (.0256) BSC
0.20 (0.008)
0.09 (0.004)
0.15 (0.006)
0.05 (0.002)
INDEX MARK
6.50 (0.256)
6.25 (0.246)
SEATING
PLANE
4.50 (0.177)
4.30 (0.169)
PIN
1
0.75 (0.030)
0.45 (0.018)
0º ~ 8º
0.30 (0.012)
0.19 (0.007)
Dimensions in Millimeters and (Inches).
Controlling dimension: Millimeters.
JEDEC Standard MO-153 AC

AT27LV520-90XU

Mfr. #:
Manufacturer:
Microchip Technology / Atmel
Description:
EPROM 512Kb (64Kx8) OTP 3V 90ns
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union