6N137, VO2601, VO2611, VO2630, VO2631, VO4661
www.vishay.com
Vishay Semiconductors
Rev. 2.0, 27-Sep-16
15
Document Number: 84732
For technical questions, contact: optocoupleranswers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SMD-8 (option 9)
Fig. 35 - Tape and Reel Shipping Medium
SOLDER PROFILES
Fig. 36 - Wave Soldering Double Wave Profile According to
J-STD-020 for DIP Devices
Fig. 37 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for SMD Devices
HANDLING AND STORAGE CONDITIONS
ESD level: HBM class 2
Floor life: unlimited
Conditions: T
amb
< 30 °C, RH < 85 %
Moisture sensitivity level 1, according to J-STD-020
4.17 (0.164)
18009
10.2 (0.402)
10.31
(0.406)
12.0 (0.472)
1.75 ± 0.1
(0.069 ± 0.004)
13.3 (0.523)
0.35 (0.014)
16.0 ± 0.3
(0.630 ± 0.012)
4 ± 0.1
(1.57 ± 0.004)
2 ± 0.05 (0.079 ± 0.002)
7.5 ± 0.05
(0.295 ± 0.002)
Embossment
Direction of feed
Center lines
of cavity
10 pitch cumulative
tolerance on tape
± 0.2 (0.008)
1.5 (0.059) min.
1.5 (0.059)
Pin 1 and
top of component
Top
cover
tape
0.1 (0.004) max.
2 K/s
second
wave
first wave
wave
ca. 5 K/s
5 s
full line: typical
dotted line:
process limits
Time (s)
Temperature (°C)
300
250
200
150
100
50
0
050100
150 200 250
94 8626
Lead temperature
235 °C to
260 °C
100 °C to
130 °C
ca. 200 K/s
forced cooling
ca. 2 K/s
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19841
255 °C
