© Semiconductor Components Industries, LLC, 2016 1 Publication Order Number :
October 2016 - Rev. 1 STK541UC62K-E/D
www.onsemi.com
ORDERING INFORMATION
See detailed ordering and shipping information on page 14 of this data sheet.
STK541UC62K-E
Intelligent Power Module (IPM)
600 V, 10 A
Overview
This “Inverter IPM” is highly integrated device containing all High Voltage
(HV) control from HV-DC to 3-phase outputs in a single SIP module
(Single-In line Package). Output stage uses IGBT/FRD technology and
implements Under Voltage Protection (UVP) and Over Current Protection
(OCP) with a Fault Detection output flag. Internal Boost diodes are provided
for high side gate boost drive.
Function
Single control power supply due to Internal bootstrap circuit for high side
pre-driver circuit
All control input and status output are at low voltage levels directly
compatible with microcontrollers
Built-in cross conduction prevention
Externally accessible embedded thermistor for substrate temperature
measurement
Certification
UL1557 (File Number : E339285)
Specifications
Absolute Maximum Ratings
at Tc = 25C
Parameter Symbol Conditions Ratings Unit
Supply voltage
V
CC
P to N, surge < 500 V *1 450 V
Collector-emitter voltage
V
CE
P to U, V, W or U, V, W to N 600 V
Output current Io
P, N, U, V, W terminal current ±10 A
P, N, U, V, W terminal current at Tc = 100C
±5 A
Output peak current Iop P, N, U, V, W terminal current for a Pulse width of 1 ms. ±20 A
Pre-driver voltage VD1, 2, 3, 4
VB1 to U, VB2 to V, VB3 to W, V
DD
to V
SS
*2 20 V
Input signal voltage VIN HIN1, 2, 3, LIN1, 2, 3
0.3 to 7
V
FLTEN terminal voltage VFLTEN FLTEN terminal
0.3 to V
DD
V
Maximum power dissipation Pd IGBT per channel 22 W
Junction temperature Tj IGBT, FRD 150
C
Storage temperature Tstg
40 to +125 C
Operating substrate
temperature
Tc IPM case temperature
40 to +100 C
Tightening torque Case mounting screws *3 0.9 Nm
Isolation voltage Vis 50 Hz sine wave AC 1 minute *4 2000 VRMS
Reference voltage is “V
SS
” terminal voltage unless otherwise specified.
*1 : Surge voltage developed by the switching operation due to the wiring inductance between “P” and “N” terminal.
*2 : Terminal voltage: VD1 = VB1 to U, VD2 = VB2 to V, VD3 = VB3 to W, VD4 = V
DD
to V
SS
*3 : Flatness of the heat-sink should be 0.15 mm and below.
*4 : Test conditions : AC 2500 V, 1 s.
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.