3
4533H–BLURF–07/07
T7024
Electrostatic sensitive device.
Observe precautions for handling.
5. Handling
Do not operate this part near strong electrostatic fields. This IC meets class 1 ESD test require-
ment (HBM in accordance to EIA/JESD22-A114-A (October 97) and class A ESD test
requirement (MM) in accordance to EIA/JESD22-A115A.
3. Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters Symbol Value Unit
Supply voltage
Pins VS_LNA, V1_PA, V2_PA, V3_PA_OUT
V
S
6V
Junction temperature T
j
150 °C
Storage temperature T
stg
–40 to +125 °C
RF input power LNA P
inLNA
5dBm
RF input power PA P
inPA
10 dBm
4. Thermal Resistance
Parameters Symbol Value Unit
Junction ambient PSSOP20, slug soldered on PCB R
thJA
19 K/W
Junction ambient QFN20, slug soldered on PCB R
thJA
27 K/W
6. Operating Range
All voltages are referred to ground (pins GND and slug). Power supply points are VS_LNA, V1_PA, V2_PA, V3_PA_OUT.
The table represents the sum of all supply currents depending on the TX/RX mode.
Parameters Symbol Min. Typ. Max. Unit
Supply voltage
Pins V1_PA, V2_PA and V3_PA_OUT
V
S
2.7 3.0 4.6 V
Supply voltage, pin VS_LNA V
S
2.7 3.0 5.5 V
Supply current TX, PSSO20
QFN20
Supply current RX
I
S
I
S
I
S
190
165
8
mA
mA
mA
Standby current, PU = 0 I
S_standby
10 µA
Ambient temperature T
amb
–25 +25 +85 °C
