12
PRECAUTIONARY NOTES
1. Handling precautions
The encapsulation material of the LED is made of sili-
cone for better product reliability. Compared to epoxy
encapsulant, which is hard and brittle, silicone is softer
and exible. Observe special handling precautions dur-
ing assembly of silicone-encapsulated LED products.
Failure to comply might lead to damage and prema-
ture failure of the LED. For more information, refer to
Application Note AN5288, Silicone Encapsulation for
LED: Advantages and Handling Precautions.
a. Do not poke sharp objects into the silicone
encapsulant. Sharp objects such as tweezers and
syringes might cause excessive force to be applied
or even pierce through the silicone, inducing failures
in the LED die or wire bond.
b. Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result
in excessive stress on the wire bond. The LED should
be held only by the body.
c. Do no stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
d. The surface of silicone material attracts more dust
and dirt compared to epoxy due to its surface
tackiness. To remove foreign particles on the surface
of silicone, a cotton bud can be used with isopropyl
alcohol (IPA). During cleaning, rub the surface gently
without applying excessive pressure on the silicone.
Ultrasonic cleaning is not recommended.
e. For automated pick and place, Avago has tested
the following nozzle size to work ne with this
LED. However, due to possible variations in other
parameters such as pick and place machine
maker/model and other settings of the machine,
it is recommended that you verify that the nozzle
selected will not damage the LED.
2. Handling of moisture-sensitive device
This product has a Moisture Sensitive Level 3 rating
per JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
a. Before use
- An unopened moisture barrier bag (MBB) can be stored
at < 40 °C/90% RH for 12 months. If the actual shelf life
has exceeded 12 months and the Humidity Indicator Card
(HIC) indicates that baking is not required, then it is safe to
reow the LEDs per the original MSL rating.
- It is recommended that the MBB not be opened before
assembly (e.g., for IQC).
b. Control after opening the MBB
- Read the HIC immediately upon opening the MBB.
- The LEDs must be kept at < 30 °C/60% RH at all
times and all high temperature related processes
including soldering, curing or rework must be
completed within 168 hours.
c. Control for unnished reel
- Unused LEDs must be stored in a sealed MBB with
desiccant or desiccator at < 5% RH.
d. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, then the PCB
must be stored in a sealed MBB with desiccant or
desiccator at < 5% RH to ensure that all LEDs have
not exceeded their oor life of 168 hours.
e. Baking is required if:
- The HIC indicator is not BROWN at 10% and is AZURE
at 5%.
- The LEDs are exposed to a condition of > 30 °C/60%
RH at any time.
- The LED oor life exceeded 168 hours.
The recommended baking condition is: 60 ± 5 °C for
20 hours.
Baking should be done only once.
f. Storage
- The soldering terminals of these Avago LEDs are
silver-plated. If the LEDs are exposed in ambient
environment for too long, the silver plating
might be oxidized and thus aect its solderability
performance. As such, unused LEDs must be kept in
a sealed MBB with desiccant or in desiccator at < 5%
RH.
ID
OD
ID = 1.7 mm
OD = 3.5 mm
