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24AA32AXT-I/ST

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
© 2006 Microchip Technology Inc. DS21713G-page 13
24AA32A/24LC32A
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
XXXXXXXX
T/XXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example:
XXXXXXXT
XXXXYYWW
NNN
8-Lead TSSOP
Example:
24LC32A
I/P 13F
0527
24LC32AI
SN 0527
13F
4LA
I527
13F
8-Lead MSOP
Example:
XXXXXT
YWWNNN
4L32AI
52713F
8-Lead SOIC (208 mil)
Example:
XXXXXXXX
T/XXXXXX
YYWWNNN
24LC32A
I/SM
052713F
XXXX
TYWW
NNN
3
e
3
e
8-Lead 2x3 DFN
Example:
264
527
13
XXX
YWW
NN
3
e
24AA32A/24LC32A
DS21713G-page 14 © 2006 Microchip Technology Inc.
Part Number
1st Line Marking Codes
TSSOP
MSOP
DFN
Standard Rotated I Temp. E Temp.
24AA32A 4AA 4AAX 4A32AT 261 262
24LC32A 4LA 4LAX 4L32AT 264 265
Note: T = Temperature grade (I, E)
Legend: XX...X Part number or part number code
T Temperature (I, E)
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
Note: In the event the full Microchip part number cannot be marked on one line, it wil
l
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
Note: Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
© 2006 Microchip Technology Inc. DS21713G-page 15
24AA32A/24LC32A
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
88
Pitch
p
.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness
c
.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top
α
51015 51015
Mold Draft Angle Bottom
β
51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

24AA32AXT-I/ST

Mfr. #:
Buy 24AA32AXT-I/ST
Manufacturer:
Microchip Technology
Description:
EEPROM 4kx8 Rot Pin
Lifecycle:
New from this manufacturer.
Delivery:
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