© 2006 Microchip Technology Inc. DS21713G-page 19
24AA32A/24LC32A
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
L
E2
A3
A1
A
TOP VIEW
D
E
EXPOSED
PAD
METAL
D2
BOTTOM VIEW
2 1
bp
n
(
NOTE 3
)
EXPOSED
TIE BAR
PIN 1
(
NOTE 1
)
ID INDEX
AREA
(
NOTE 2
)
CONFIGURATION
CONTACT
ALTERNATE
DETAIL
K
3.
Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent MO-229 VCED-2
See ASME Y14.5M
See ASME Y14.5M
MILLIMETERS
*
0.50 BSC
2.00 BSC
0.20 REF.
3.00 BSC
1.
Pin 1 visual index feature may vary, but must be located within the hatched area.
.039.035
.031 0.80AOverall Height
2.
Exposed pad may vary according to die attach paddle size.
*
Controlling Parameter
Contact Length §
Notes:
Contact Width
Standoff
Overall Width
Overall Length
Contact Thickness
Exposed Pad Width
Exposed Pad Length
.010.008
L
b .012 0.20
.001
.008 REF.
.079 BSC
–
–
.118 BSC
D
.051
.059
D2
E2
E
.000
A3
A1
.069
.075
1.30
**
1.50
**
.002 0.00
Dimension Limits
Pitch
Number of Pins
INCHES
.020 BSC
MIN
n
e
NOM
Units
8
MAX MIN
1.00
0.90
0.25 0.30
–
–
1.75
1.90
0.02 0.05
8
NOM
MAX
Contact-to-Exposed Pad
§
.012
K
.016 0.40.020 0.30 0.50
**
Not within JEDEC parameters
§
Significant Characteristic
.008 – – 0.20 ––
DWG No. C04-123
Revised 09-12-05
