IRG4BC30KDSTRLP

Parameter Typ. Max. Units
R
θJC
Junction-to-Case - IGBT  1.2
R
θJC
Junction-to-Case - Diode 2.5
R
θCS
Case-to-Sink, Flat, Greased Surface 0.5  °C/W
R
θJA
Junction-to-Ambient ( PCB Mounted,steady-state)  40
Wt Weight 1.44  g
Parameter Max. Units
V
CES
Collector-to-Emitter Voltage 600 V
I
C
@ T
C
= 25°C Continuous Collector Current 28
I
C
@ T
C
= 100°C Continuous Collector Current 16
I
CM
Pulsed Collector Current 56 A
I
LM
Clamped Inductive Load Current 56
I
F
@ T
C
= 100°C Diode Continuous Forward Current 12
I
FM
Diode Maximum Forward Current 58
t
sc
Short Circuit Withstand Time 10 µs
V
GE
Gate-to-Emitter Voltage ± 20 V
P
D
@ T
C
= 25°C Maximum Power Dissipation 100
P
D
@ T
C
= 100°C Maximum Power Dissipation 42
T
J
Operating Junction and -55 to +150
T
STG
Storage Temperature Range °C
Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Mounting Torque, 6-32 or M3 Screw. 10 lbfin (1.1 Nm)
IRG4BC30KD-SPbF
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST
SOFT RECOVERY DIODE
Features
E
G
n-channel
C
V
CES
= 600V
V
CE(on) typ.
= 2.21V
@V
GE
= 15V, I
C
= 16A
Short Circuit Rated
UltraFast IGBT
02/08/10
High short circuit rating optimized for motor control,
t
sc
=10µs, @360V V
CE
(start), T
J
= 125°C, V
GE
= 15V
Combines low conduction losses with high switching
speed
tighter parameter distribution and higher efficiency than
previous generations
 IGBT co-packaged with HEXFRED
TM
ultrafast,
ultrasoft recovery antiparallel diodes
Lead-Free
Benefits
Latest generation 4 IGBTs offer highest power
density motor controls possible
 HEXFRED
TM
diodes optimized for performance with
IGBTs. Minimized recovery characteristic reduce noise,
EMI and switching losses
 This part replaces the IRGBC30KD2-S and
IRGBC30MD2-S products
For hints see design tip 97003
Absolute Maximum Ratings
W
Thermal Resistance
www.irf.com 1
D
2
Pak
PD -95674A
IRG4BC30KD-SPbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
Q
g
Total Gate Charge (turn-on) 67 100 I
C
= 16A
Q
ge
Gate - Emitter Charge (turn-on) 11 16 nC V
CC
= 400V See Fig.8
Q
gc
Gate - Collector Charge (turn-on) 25 37 V
GE
= 15V
t
d(on)
Turn-On Delay Time 60
t
r
Rise Time 42 T
J
= 25°C
t
d(off)
Turn-Off Delay Time 160 250 I
C
= 16A, V
CC
= 480V
t
f
Fall Time 80 120 V
GE
= 15V, R
G
= 23
E
on
Turn-On Switching Loss 0.60 Energy losses include "tail"
E
off
Turn-Off Switching Loss 0.58 mJ and diode reverse recovery
E
ts
Total Switching Loss 1.18 1.6 See Fig. 9,10,14
t
sc
Short Circuit Withstand Time 10 µs V
CC
= 360V, T
J
= 125°C
V
GE
= 15V, R
G
= 10 , V
CPK
< 500V
t
d(on)
Turn-On Delay Time 58 T
J
= 150°C, See Fig. 11,14
t
r
Rise Time 42 I
C
= 16A, V
CC
= 480V
t
d(off)
Turn-Off Delay Time 210 V
GE
= 15V, R
G
= 23
t
f
Fall Time 160 Energy losses include "tail"
E
ts
Total Switching Loss 1.69 mJ and diode reverse recovery
L
E
Internal Emitter Inductance 7.5 nH Measured 5mm from package
C
ies
Input Capacitance 920 V
GE
= 0V
C
oes
Output Capacitance 110 pF V
CC
= 30V See Fig. 7
C
res
Reverse Transfer Capacitance 27  = 1.0MHz
t
rr
Diode Reverse Recovery Time 42 60 T
J
= 25°C See Fig.
80 120 T
J
= 125°C 14 I
F
= 12A
I
rr
Diode Peak Reverse Recovery Current 3.5 6.0 T
J
= 25°C See Fig.
5.6 10 T
J
= 125°C 15 V
R
= 200V
Q
rr
Diode Reverse Recovery Charge 80 180 T
J
= 25°C See Fig.
220 600 T
J
= 125°C 16 di/dt = 200Aµs
di
(rec)M
/dt Diode Peak Rate of Fall of Recovery 180 T
J
= 25°C See Fig.
During t
b
160 T
J
= 125°C 17
Parameter Min. Typ. Max. Units Conditions
V
(BR)CES
Collector-to-Emitter Breakdown Voltage 600 V V
GE
= 0V, I
C
= 250µA
V
(BR)CES
/T
J
Temperature Coeff. of Breakdown Voltage 0.54 V/°C V
GE
= 0V, I
C
= 1.0mA
V
CE(on)
Collector-to-Emitter Saturation Voltage 2.21 2.7 I
C
= 16A V
GE
= 15V
2.88 I
C
= 28A See Fig. 2, 5
2.36 I
C
= 16A, T
J
= 150°C
V
GE(th)
Gate Threshold Voltage 3.0 6.0 V
CE
= V
GE
, I
C
= 250µA
V
GE(th)
/T
J
Temperature Coeff. of Threshold Voltage -12 mV/°C V
CE
= V
GE
, I
C
= 250µA
g
fe
Forward Transconductance 5.4 8.1 S V
CE
= 100V, I
C
= 16A
I
CES
Zero Gate Voltage Collector Current 250 V
GE
= 0V, V
CE
= 600V
2500 V
GE
= 0V, V
CE
= 600V, T
J
= 150°C
V
FM
Diode Forward Voltage Drop 1.4 1.7 I
C
= 12A See Fig. 13
1.3 1.6 I
C
= 12A, T
J
= 150°C
I
GES
Gate-to-Emitter Leakage Current ±100 nA V
GE
= ±20V
Switching Characteristics @ T
J
= 25°C (unless otherwise specified)
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
ns
ns
V
µA
V
nC
A/µs
A
ns
IRG4BC30KD-SPbF
www.irf.com 3
0.1 1 10 100
0.0
0.5
1.0
1.5
2.0
2.5
f, Frequency (KHz)
LOAD CURRENT (A)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I
RMS
of fundamental)
For both:
Duty cycle: 50%
T = 125°C
T = 90°C
Gate drive as specified
sink
J
Power Dissipation = W
60% of rated
voltage
I
Ideal diodes
Square wave:
1.8
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
0.1
1
10
100
1 10
V , Collector-to-Emitter Voltage (V)
I , Collector-to-Emitter Current (A)
CE
C
V = 15V
20µs PULSE WIDTH
GE
T = 25 C
J
o
T = 150 C
J
o
0.1
1
10
100
5 10 15
V , Gate-to-Emitter Voltage (V)
I , Collector-to-Emitter Current (A)
GE
C
V = 50V
s PULSE WIDTH
CC
T = 25 C
J
o
T = 150 C
J
o
55°C

IRG4BC30KDSTRLP

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
IGBT Modules 600V 23A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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