CREAT BY ART
- Very low profile, typical height of 1.1mm
- Excellent high temperature stability
- Glass passivated chip junction
- Controlled avalanche characteristics
- Low leakage current
- High forward surge capability
- Halogen-free according to IEC 61249-2-21
Molding compound: UL flammability classification rating 94V-0
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
SYMBOL UNIT
V
RRM
V
I
F(AV)
A
T
J
=25°C
T
J
=125°C
T
J
=25°C
T
J
=125°C
R
θJM
(2)
R
θJA
(3)
C
J
pF
T
J
°C
T
STG
°C
Version: B1511
20
30
mJ
TYP MAX
95 120
Maximum instantaneous forward voltage
(1)
I
F
=3A
Rated V
R
Maximum reverse current
E
AS
Non-repetitive avalanche energy
I
AS
= 2.5A Max
I
AS
= 1.0A Typ
V
F
1.55
600
1.02 1.15
TYP MAX
Maximum reverse recovery time
Note 3: Free air, mounted on recommended pad
Note 1: Pulse test with PW=300μs, 1% duty cycle
t
rr
TPAR3G TPAR3J
AR3D AR3G AR3J
1.20
- 55 to +175
- 55 to +175
Typical thermal resistance
I
F
=0.5A, I
R
=1A, I
RR
=0.25A
Note 4: Measured at 1 MHz and Applied V
R
=4.0 V
ns
Typical junction capacitance
(4)
58
5.1
75
°C/W
Note 2: Junction to mounted, mounted on FR4 PCB with 16mm x 16mm Cu pad area
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
I
FSM
60
I
R
40
Operating junction temperature range
250
Storage temperature range
Polarity: Indicated by cathode band
Weight: 95 mg (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25°C unless otherwise noted)
μA
Marking code
Maximum average forward rectified current 3
PARAMETER
A
V
Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: TO-277A (SMPC)
0.30 10
Maximum repetitive peak reverse voltage
TPAR3D
200 400
TO-277A (SMPC)
TPAR3D - TPAR3J
Taiwan Semiconductor
3A, 200V - 600V Avalanche Fast Recover
Surface Mount Rectifiers
FEATURES
1
2
3
