BSS816NWH6327XTSA1

BSS816NW
OptiMOS™2 Small-Signal-Transistor
Features
• N-channel
• Enhancement mode
• Ultra Logic level (1.8V rated)
• Avalanche rated
• Qualified according to AEC Q101
• 100% lead-free; RoHS compliant
• Halogen-free according to IEC61249-2-21
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current
I
D
T
A
=25 °C
1.4 A
T
A
=70 °C
1.1
Pulsed drain current
I
D,pulse
T
A
=25 °C
5.6
Avalanche energy, single pulse
E
AS
I
D
=1.4 A, R
GS
=25 Ω
3.7 mJ
Reverse diode dv /dt dv /dt
I
D
=1.4 A, V
DS
=16 V,
di /dt=200 A/µs,
T
j,max
=150 °C
6 kV/µs
Gate source voltage
V
GS
±8 V
Power dissipation
1)
P
tot
T
A
=25 °C
W
Operating and storage temperature
T
j
, T
stg
-55 ... 150 °C
ESD Class JESD22-A114 -HBM 0 (<250V)
Soldering Temperature 260 °C
IEC climatic category; DIN IEC 68-1 55/150/56
Value
0.5
PG-SOT323
2
3
1
Type Package Tape and Reel Information Marking Lead Free Packing
BSS816NW PG-SOT323 H6327: 3000 pcs/ reel XCs Yes Non dry
V
DS
20 V
R
DS(on),max
V
GS
=2.5 V 160
mΩ
V
GS
=1.8 V 240
I
D
1.4 A
Product Summary
Rev 2.3 page 1 2011-07-13
BSS816NW
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance,
junction - ambient
R
thJA
minimal footprint
1)
- - 250 K/W
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 µA
20 - - V
Gate threshold voltage
V
GS(th)
V
DS
=0 V, I
D
=3.7 µA
0.3 0.55 0.75
Drain-source leakage current
I
DSS
V
DS
=20 V, V
GS
=0 V,
T
j
=25 °C
--1
μA
V
DS
=20 V, V
GS
=0 V,
T
j
=150 °C
- - 100
Gate-source leakage current
I
GSS
V
GS
=8 V, V
DS
=0 V
- - 100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=1.8 V, I
D
=0.44 A
- 153 240
mΩ
V
GS
=2.5 V, I
D
=1.4 A
- 107 160
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=1.1 A
4.9 - S
Values
1)
Performed on 40mm
2
FR4 PCB. The traces are 1mm wide, 70μm thick and 20mm long; they are present on both sides
of the PCB.
Rev 2.3 page 2 2011-07-13
BSS816NW
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
Input capacitance
C
iss
- 126 180 pF
Output capacitance
C
oss
-4767
Reverse transfer capacitance
C
rss
-710
Turn-on delay time
t
d(on)
- 5.3 - ns
Rise time
t
r
- 9.0 -
Turn-off delay time
t
d(off)
-11-
Fall time
t
f
- 2.2 -
Gate Charge Characteristics
Gate to source charge
Q
gs
- 0.2 - nC
Gate to drain charge
Q
gd
- 0.2 -
Gate charge total
Q
g
- 0.6 -
Gate plateau voltage
V
plateau
- 1.6 - V
Reverse Diode
Diode continous forward current
I
S
- - 0.5 A
Diode pulse current
I
S,pulse
--6
Diode forward voltage
V
SD
V
GS
=0 V, I
F
=1.4 A,
T
j
=25 °C
- 0.87 1.1 V
Reverse recovery time
t
rr
- 8.1 - ns
Reverse recovery charge
Q
rr
- 1.4 - nC
V
R
=10 V, I
F
=1.4 A,
di
F
/dt =100 A/µs
T
A
=25 °C
Values
V
GS
=0 V, V
DS
=10 V,
f =1 MHz
V
DD
=10 V, V
GS
=2.5 V,
I
D
=1.4 A, R
G
=6 Ω
V
DD
=10 V, I
D
=1.4 A,
V
GS
=0 to 2.5 V
Rev 2.3 page 3 2011-07-13

BSS816NWH6327XTSA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET N-Ch 20V 1.4A SOT-323-3
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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