NCP500, NCV500
www.onsemi.com
18
PACKAGE DIMENSIONS
DFN6, 2x2.2, 0.65P
SQL SUFFIX
CASE 506BA
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
E
D
D2
E2
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
K
6X
NOTE 3
2X
0.10 C
PIN ONE
REFERENCE
TOP VIEW
2X
0.10 C
7X
A
A1
0.08 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
L
6X
1
3
46
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
b 0.20 0.30
D 2.00 BSC
D2 1.10 1.30
E 2.20 BSC
E2 0.70 0.90
e 0.65 BSC
K 0.20 −−−
L 0.25 0.35
L1 0.00 0.10
L1
6X
0.58
1.36
0.96
1
0.35
0.65
PITCH
2.50
6X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPD
EXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DETAIL A
PACKAGE
OUTLINE
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