IXYS Reserves the Right to Change Limits, Test Conditions and Dimensions.
IXYF30N450
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
g
fS
I
C
= 30A, V
CE
= 10V, Note 1 11 18 S
C
ies
1840 pF
C
oes
V
CE
= 25V, V
GE
= 0V, f = 1MHz 83 pF
C
res
35 pF
Q
g
88 nC
Q
ge
I
C
= 30A, V
GE
= 15V, V
CE
= 1000V 11 nC
Q
gc
40 nC
t
d(on)
38 ns
t
r
318 ns
t
d(off)
168 ns
t
f
1220 ns
t
d(on)
42 ns
t
r
590 ns
t
d(off)
180 ns
t
f
1365 ns
R
thJC
0.54 °C/W
R
thCS
0.15 °C/W
Resistive Switching Times, T
J
= 125°C
I
C
= 30A, V
GE
= 15V
V
CE
= 960V, R
G
= 15
Resistive Switching Times, T
J
= 25°C
I
C
= 30A, V
GE
= 15V
V
CE
= 960V, R
G
= 15
ISOPLUS i4-Pak
TM
(HV) Outline
Pin 1 = Gate
Pin2 = Emitter
Pin 3 = Collector
Tab 4 = Isolated
Notes:
1. Pulse test, t < 300s, duty cycle, d < 2%.
2. Device must be heatsunk for high-temperature leakage current
measurements to avoid thermal runaway.
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute
a "considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.