Electrical Characteristics
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other condi-
tions above those indicated in the operational sections of this specification is not im-
plied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
Table 9: mSATA Power Consumption
Density Idle Average Active Average
Sequential Write/Read Maximum
(128k transfer) Unit
32GB <65 150 1900 1600
64GB <65 150 2400 1700 mW
Notes:
1. Data taken at 25°C using a 6 Gb/s SATA interface.
2. Active average power measured while running MobileMark
®
2007 Productivity Suite.
3. DIPM (device-initiated power management) enabled.
4. Sequential power measured in IOMETER MAX with 128KB transfer size.
Table 10: Maximum Ratings
Parameter/Condition Symbol Min Max Unit
Voltage input 3V3 3.14 3.46 V
Operating temperature T
C
0 70 °C
Non-operating temperature –40 85 °C
Rate of temperature change – 20 °C/hour
Relative humidity (non-condensing) 5 95 %
Notes:
1. Temperature is best measured with a thermocouple attached to the center point of the
drive controller ASIC package. This is the larger package closest to the interface connec-
tor on the primary side. Refer to the Package Dimensions for details.
2. Supply voltage slew rate during asynchronous power-down should follow a slope of no
steeper than 60 mV/ms.
3. Power-off sequence: When the Micron C400 SSD is shut down, the ATA STANDBY IMME-
DIATE (STBI) command should be the last command sent by the host and acknowledged
by the SSD. Failure to follow this process could result in a longer than normal time-to-
ready(TTR) during the subsequent power-on sequence. TTR is the time from power-on
to drive ready to accept SATA commands.
Table 11: Shock and Vibration
Parameter/Condition Specification
Operating shock 1500 G/1.0ms
Operating vibration 2–500Hz at 3.1G
C400v mSATA NAND Flash SSD
Electrical Characteristics
PDF: 09005aef8485be28
realssd_c400v_msata.pdf - Rev. E 8/12 EN
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