AD7416/AD7417/AD7418
Rev. I | Page 22 of 24
16
9
81
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 28. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0
.95
0
.85
0
.75
Figure 29. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
AD7416/AD7417/AD7418
Rev. I | Page 23 of 24
ORDERING GUIDE
Model
1
Temperature
Range
Temperature
Error Package Description Branding
Package
Option
AD7416AR −40°C to +125°C ±2°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
AD7416AR-REEL −40°C to +125°C ±2°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
AD7416AR-REEL7 −40°C to +125°C ±2°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
AD7416ARZ −40°C to +125°C ±2°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
AD7416ARZ-REEL −40°C to +125°C ±2°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
AD7416ARZ-REEL7 −40°C to +125°C ±2°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
AD7416ARM −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) C6A RM-8
AD7416ARM-REEL −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) C6A RM-8
AD7416ARM-REEL7 −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) C6A RM-8
AD7416ARMZ −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) C6A# RM-8
AD7416ARMZ-REEL −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) C6A# RM-8
AD7416ARMZ-REEL7 −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) C6A# RM-8
AD7417-WAFER Bare Die Wafer
AD7417AR −40°C to +125°C ±2°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417AR-REEL −40°C to +125°C ±2°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417AR-REEL7 −40°C to +125°C ±2°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417ARZ −40°C to +125°C ±2°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417ARZ-REEL −40°C to +125°C ±2°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417ARZ-REEL7 −40°C to +125°C ±2°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417ARU −40°C to +125°C ±2°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
AD7417ARU-REEL −40°C to +125°C ±2°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
AD7417ARU-REEL7 −40°C to +125°C ±2°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
AD7417ARUZ −40°C to +125°C ±2°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
AD7417ARUZ-REEL −40°C to +125°C ±2°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
AD7417ARUZ-REEL7 −40°C to +125°C ±2°C 16-Lead Thin Shrink Small Outline Package (TSSOP) RU-16
AD7417BR −40°C to +85°C ±1°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417BR-REEL −40°C to +85°C ±1°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417BR-REEL7 −40°C to +85°C ±1°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417BRZ −40°C to +85°C ±1°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417BRZ-REEL −40°C to +85°C ±1°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7417BRZ-REEL7 −40°C to +85°C ±1°C 16-Lead Standard Small Outline Package (SOIC_N) R-16
AD7418ACHIPS Die
AD7418ARZ −40°C to +125°C ±2°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
AD7418ARZ-REEL −40°C to +125°C ±2°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
AD7418ARZ-REEL7 −40°C to +125°C ±2°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
AD7418ARM −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) C7A RM-8
AD7418ARM-REEL −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) C7A RM-8
AD7418ARM-REEL7 −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) C7A RM-8
AD7418ARMZ −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) T0G RM-8
AD7418ARMZ-REEL −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) T0G RM-8
AD7418ARMZ-REEL7 −40°C to +125°C ±2°C 8-Lead Mini Small Outline Package (MSOP) T0G RM-8
EVAL-AD7416/7/8EBZ Evaluation Board
1
Z = RoHS Compliant Part.
AD7416/AD7417/AD7418
Rev. I | Page 24 of 24
NOTES
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (Now NXP Semiconductors).
©1998–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D01126-0-11/10(I)

AD7417ARUZ-REEL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Board Mount Temperature Sensors 4CH I2C W/ ON-CHIP TEMP SENSOR IC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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