NTCS0603XX104HXT

2322 615 3....
Surface Mount, NTC Thermistors
Vishay BCcomponents
Document Number: 29056 For technical questions contact: nlr
.europe@vishay.com www.vishay.com
Revision: 10-Oct-03 41
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with “CECC 00802”. The maximum temperature
of 260 °C during 10 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
0 50 100 150 200 250
300
250
200
150
100
50
0
10 s
260 C
130 C
( C)
t (s)
245 C
215 C
180 C
10 s
40 s
2 K/s
T
JW166
2.3
0.9
0.9
Dimensions in mm.
Typical values (solid line).
Process limits (dotted lines).
Reflow soldering.
Dimensions of the solder lands.
115 4025.87 2.81 3.98
120 3502.66 2.75 4.24
125 3057.12 2.68 4.50
130 2676.44 2.62 4.76
135 2350.10 2.57 5.00
140 2069.46 2.51 5.25
145 1827.38 2.46 5.48
150 1617.93 2.40 5.71
T
oper
(°°
°°
C)
CATALOG NUMBER 2322 615 3.104
R
T
(
)
TC
(%/K)
R/R DUE TO B-TOLERANCE
(%)
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with “IEC 60286-3”. Basic dimensions are given below . Carrier tape material is paper.
PAPER TAPE
F
W
P
0
P
2
D
0
B
0
A
0
P
1
E
1
JWB288
T
T
1
Cumulative pitch error: 0.2 mm over 10 pitches.
Cumulative tolerance over 10 holes: ±0.2 mm.
2322 615 3....
Vishay BCcomponents
Surface Mount, NTC Thermistors
www.vishay.com For technical questions contact: nlr
.europe@vishay.com Document Number: 29056
42 Revision: 10-Oct-03
DIMENSIONS OF PAPER TAPE in millimeters
Notes
1. Measured 0.3 mm above base pocket.
2. P0 pitch tolerance over any 10 pitches is ±0.2 mm.
PARAMETER DIMENSION TOLERANCE
A
0
; note 1 1.15 ±0.1
B
0
; note 1 1.9 ±0.1
K
0
4.1 ±0.1
W 8.0 ±0.2
E1 1.75 ±0.1
F 3.5 ±0.05
D
0
1.55 ±0.05
D
1
1.5 +0.1/0.0
P
0
; note 2 4.0 ±0.1
P
1
12 ±0.1
P
2
2.0 ±0.05
T tape thickness 1.1 max
T
1
cover tape <0.1
LEADER/TRAILER TAPE SPECIFICATION
TAPING PACKAGE REQUIREMENTS
Component is free and not sticking to top and/or bottom tape.
Component should be easy to remove from carrier tape.
TESTS AND REQUIREMENTS
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
6Tc
solderability 2 s at 235 °C min. 95% of surface wetted
resistance to soldering heat 10 s at 260 °C R/R < 5%
Leader/trailer tape.
CCB838
empty compartments
with cover tape
(min. 240 mm)
cover tape only
leader 400 mm
trailer (min. 160 mm)
trailer end
leader end

NTCS0603XX104HXT

Mfr. #:
Manufacturer:
Vishay
Description:
Thermistors - NTC 100Kohms 3%
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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