CY7C1020BN-15ZXC

32K x 16 Static RAM
CY7C1020BN
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document #: 001-06443 Rev. ** Revised February 1, 2006
Features
•High speed
—t
AA
= 12, 15 ns
CMOS for optimum speed/power
Low active power
825 mW (max.)
Low CMOS standby power (L version only)
2.75 mW (max.)
Automatic power-down when deselected
Independent control of upper and lower bits
Available in 44-pin TSOP II and 400-mil SOJ
Functional Description
The CY7C1020BN is a high-performance CMOS static RAM
organized as 32,768 words by 16 bits. This device has an
automatic power-down feature that significantly reduces
power consumption when deselected.
Writing to the device is accomplished by taking Chip Enable
(CE
) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE
) is LOW, then data from I/O pins (I/O
1
through I/O
8
), is
written into the location specified on the address pins (A
0
through A
15
). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O
9
through I/O
16
) is written into the location
specified on the address pins (A
0
through A
15
).
Reading from the device is accomplished by taking Chip
Enable (CE
) and Output Enable (OE) LOW while forcing the
Write Enable (WE
) HIGH. If Byte Low Enable (BLE) is LOW,
then data from the memory location specified by the address
pins will appear on I/O
1
to I/O
8
. If Byte High Enable (BHE) is
LOW, then data from memory will appear on I/O
9
to I/O
16
. See
the truth table at the back of this data sheet for a complete
description of read and write modes.
The input/output pins (I/O
1
through I/O
16
) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1020BN is available in standard 44-pin TSOP Type
II and 400-mil-wide SOJ packages.
WE
Logic Block Diagram
Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
14
31
32
36
35
34
33
37
40
39
38
Top View
SOJ / TSOP II
12
13
41
44
43
42
16
15
29
30
V
CC
A
15
A
14
A
13
A
12
NC
NC
A
3
OE
V
SS
A
5
I/O
16
A
2
CE
I/O
3
I/O
1
I/O
2
BHE
NC
A
1
A
0
18
17
20
19
I/O
4
27
28
25
26
22
21
23
24
NC
V
SS
I/O
7
I/O
5
I/O
6
I/O
8
A
6
A
7
BLE
V
CC
I/O
15
I/O
14
I/O
13
I/O
12
I/O
11
I/O
10
I/O
9
A
8
A
9
A
10
A
11
32K x 16
RAM Array
I/O
1
–I/O
8
ROW DECODER
A
7
A
6
A
5
A
4
A
3
A
0
COLUMN DECODER
A
9
A
10
A
11
A
12
A
13
A
14
SENSE AMPS
DATA IN DRIVERS
OE
A
2
A
1
I/O
9
–I/O
16
CE
WE
BLE
BHE
A
8
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CY7C1020BN
Document #: 001-06443 Rev. ** Page 2 of 8
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage on V
CC
to Relative GND
[1]
.... –0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State
[1]
......................................–0.5V to V
CC
+0.5V
DC Input Voltage
[1]
...................................–0.5V to V
CC
+0.5V
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.....................................................>200 mA
Selection Guide
7C1020BN-12 7C1020BN-15
Maximum Access Time (ns) 12 15
Maximum Operating Current (mA) 140 130
Maximum CMOS Standby Current (mA) 3 3
L 0.5 0.5
Operating Range
Range
Ambient
Temperature
[2]
V
CC
Commercial 0×C to +70×C 5V ± 10%
Industrial –40×C to +85×C 5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter Description
Test
Conditions
7C1020BN-12 7C1020BN-15
UnitMin. Max. Min. Max.
V
OH
Output HIGH Voltage V
CC
= Min., I
OH
= –4.0 mA 2.4 2.4 V
V
OL
Output LOW Voltage V
CC
= Min., I
OL
= 8.0 mA 0.4 0.4 V
V
IH
Input HIGH Voltage 2.2 6.0 2.2 6.0 V
V
IL
Input LOW Voltage
[1]
–0.5 0.8 –0.5 0.8 V
I
IX
Input Load Current GND < V
I
< V
CC
–1 +1 –1 +1 µA
I
OZ
Output Leakage Current GND < V
I
< V
CC
, Output Disabled –1 +1 –1 +1 µA
I
OS
Output Short Circuit Current
[3]
V
CC
= Max., V
OUT
= GND –300 –300 mA
I
CC
V
CC
Operating Supply Current V
CC
= Max.,
I
OUT
= 0 mA, f = f
MAX
= 1/t
RC
140 130 mA
I
SB1
Automatic CE Power-Down
Current—TTL Inputs
Max. V
CC
, CE > V
IH
V
IN
> V
IH
or V
IN
< V
IL
, f = f
MAX
20 20 mA
I
SB2
Automatic CE Power-Down
Current—CMOS Inputs
Max. V
CC
, CE > V
CC
– 0.3V,
V
IN
> V
CC
– 0.3V, or V
IN
< 0.3V,
f = 0
3 3 mA
L 0.5 0.5 mA
Capacitance
[4]
Parameter Description Test Conditions Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
CC
= 5.0V
8 pF
C
OUT
Output Capacitance 8 pF
Notes:
1. V
IL
(min.) = –2.0V for pulse durations of less than 20 ns.
2. T
A
is the case temperature.
3. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
4. Tested initially and after any design or process changes that may affect these parameters.
[+] Feedback
CY7C1020BN
Document #: 001-06443 Rev. ** Page 3 of 8
AC Test Loads and Waveforms
Switching Characteristics
[5]
Over the Operating Range
Parameter Description
7C1020BN-12 7C1020BN-15
UnitMin. Max. Min. Max.
Read Cycle
t
RC
Read Cycle Time 12 15 ns
t
AA
Address to Data Valid 12 15 ns
t
OHA
Data Hold from Address Change 3 3 ns
t
ACE
CE LOW to Data Valid 12 15 ns
t
DOE
OE LOW to Data Valid 6 7 ns
t
LZOE
OE LOW to Low Z
[6]
0 0 ns
t
HZOE
OE HIGH to High Z
[6, 7]
6 7 ns
t
LZCE
CE LOW to Low Z
[6]
3 3 ns
t
HZCE
CE HIGH to High Z
[6, 7]
6 7 ns
t
PU
CE LOW to Power-Up 0 0 ns
t
PD
CE HIGH to Power-Down 12 15 ns
t
DBE
Byte Enable to Data Valid 6 7 ns
t
LZBE
Byte Enable to Low Z 0 0 ns
t
HZBE
Byte Disable to High Z 6 7 ns
Write Cycle
[8]
t
WC
Write Cycle Time 12 15 ns
t
SCE
CE LOW to Write End 9 10 ns
t
AW
Address Set-Up to Write End 8 10 ns
t
HA
Address Hold from Write End 0 0 ns
t
SA
Address Set-Up to Write Start 0 0 ns
t
PWE
WE Pulse Width 8 10 ns
t
SD
Data Set-Up to Write End 6 8 ns
t
HD
Data Hold from Write End 0 0 ns
t
LZWE
WE HIGH to Low Z
[6]
3 3 ns
t
HZWE
WE LOW to High Z
[6, 7]
6 7 ns
t
BW
Byte Enable to End of Write 8 9 ns
Notes:
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
I
OL
/I
OH
and 30-pF load capacitance.
6. At any given temperature and voltage condition, t
HZCE
is less than t
LZCE
, t
HZOE
is less than t
LZOE
, and t
HZWE
is less than t
LZWE
for any given device.
7. t
HZOE
, t
HZBE
, t
HZCE
, and t
HZWE
are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state
voltage.
8. The internal write time of the memory is defined by the overlap of CE
LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate
a write, and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal
that terminates the write.
90%
10%
3.0V
GND
90%
10%
ALL INPUT PULSES
5V
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
5V
OUTPUT
5 pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
R 481
R 481
R2
255
R2
255
167
Equivalent to:
THÉVENIN
EQUIVALENT
1.73V
30 pF
Rise Time: 1 V/ns Fall Time: 1 V/ns
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CY7C1020BN-15ZXC

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 512K PARALLEL 44TSOP II
Lifecycle:
New from this manufacturer.
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