4
Recommended Solder Fluxes and Cleaning/Degreasing
Chemicals
Solder uxes used with the AFCT‑5815xZ ber‑optic
transceiver should be water‑soluble, organic solder ux‑
es. Some recommended solder uxes are Lonco 3355‑11
from London Chemical West, Inc. of Burbank, CA, and 100
Flux from Alpha Metals of Jersey City, NJ.
Recommended cleaning and degreasing chemicals for
the AFCT‑5815xZ are alcohol’s (methyl, isopropyl, isobu‑
tyl), aliphatics (hexane, heptane) and other chemicals,
such as soap solution or naphtha. Do not use partially
halogenated hydrocarbons for cleaning/degreasing. Ex‑
amples of chemicals to avoid are 1.1.1. trichloroethane,
ketones (such as MEK), acetone, chloroform, ethyl ac‑
etate, methylene dichloride, phenol, methylene chloride
or N‑methylpyrrolidone.
Evaluation Circuit Boards
Evaluation circuit boards are available from Avago Tech‑
nologies Application Engineering sta. Contact your
local Avago Technologies sales representative to arrange
for access to one if needed.
Recommended Solder and Wash Process
The AFCT‑5815xZ is compatible with industry standard
wave or hand solder processes.
A drying cycle must be completed after wash process to
remove all moisture from the module.
AFCT-5815xZ Process Plug
The AFCT‑5815xZ transceiver is supplied with a process
plug for protection of the optical ports with the Duplex
SC connector receptacle. This process plug prevents con‑
tamination during wave solder and aqueous rinse as well
as during handling, shipping or storage. Each process
plug can only be used once during processing, although
with subsequent use, it can be used as a dust cover. It is
made of high‑temperature, molded, sealing material that
will withstand +85°C and a rinse pressure of 110 lb/in
2
.
Figure 4. Recommended Board Layout Hole Pattern
20.32
(0.800)
2 x Ø 1.9 ± 0.1
(0.075 ± 0.004)
20.32
(0.800)
2.54
9 x Ø 0.8 ± 0.1
(0.032 ± 0.004)
DIMENSIONS ARE IN MILLIMETERS (INCHES)