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LTC1911EMS8-1.8#PBF

P1-P3P4-P6P7-P9P10-P12
10
LTC1911-1.5/LTC1911-1.8
1911f
APPLICATIO S I FOR ATIO
WUUU
is needed to ensure that minimum capacitance values are
met over operating temperature and bias voltage.
Table 1 is a list of ceramic capacitor manufacturers and
how to contact them.
Table 1. Ceramic Capacitor Manufacturers
AVX 1-(803)-448-1943 www.avxcorp.com
Kemet 1-(864) 963-6300 www.kemet.com
Murata 1-(800) 831-9172 www.murata.com
Taiyo Yuden 1-(800) 348-2496 www.t-yuden.com
Vishay 1-(800) 487-9437 www.vishay.com
Layout Considerations
Due to the high switching frequency and transient cur-
rents produced by the LTC1911, careful board layout is
necessary for optimal performance. A true ground plane
and short connections to all capacitors will optimize
performance, reduce noise and ensure proper regulation
over all conditions. Figure 3 shows the recommended
layout configuration.
Additional output filtering can be achieved by placing a
second output capacitor, connected to the ground plane,
about 2cm or more from the LTC1911 output capacitor
(C4). The inductance of the trace running to the second
output capacitor will significantly attenuate the high speed
switching transients of the LTC1911. Even small capaci-
tors as low as 0.1µF will provide excellent results.
Thermal Management
The power dissipation in the LTC1911 can cause the
junction temperature to rise at rates of up to 160°C/W. If
the specified operating conditions are followed, the junc-
tion temperature should never exceed the 160°C thermal
shutdown temperature. The junction temperature can
come very close and possibly exceed the specified 125°C
operating junction temperature. To reduce the maximum
junction temperature, a good thermal connection to the PC
board is recommended. Connecting the GND pin (Pin 4) to
a ground plane, and maintaining a solid ground plane
under the device on two layers of the PC board, can reduce
the thermal resistance of the package and PC board
considerably.
C1
1911 F03
C4
OUTGND
C2
V
IN
SS/SHDN
: CONNECT TO GND PLANE ON BACK OF BOARD
C3
U1
Figure 3. Recommended Component Placement and Grounding
11
LTC1911-1.5/LTC1911-1.8
1911f
U
PACKAGE DESCRIPTIO
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
MSOP (MS8) 0102
0.53 ± 0.015
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.077)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
0.13 ± 0.05
(.005 ± .002)
0.86
(.034)
REF
0.65
(.0256)
BCS
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.88
± 0.1
(.192 ± .004)
8
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
NOTE 4
0.52
(.206)
REF
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889
± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.04
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
12
LTC1911-1.5/LTC1911-1.8
1911f
LINEAR TECHNOLOGY CORPORATION 2001
LT/TP 1102 2K • PRINTED IN USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
PART NUMBER DESCRIPTION COMMENTS
LTC1514 50mA, 650kHz, Step-Up/Down Charge Pump V
IN
= 2.7V to 10V, V
OUT
= 3V to 5V, I
Q
= 60µA, I
SD
= 10µA,
with Low Battery Comparator S8 Package
LTC1515 50mA, 650kHz, Step-Up/Down Charge Pump V
IN
= 2.7V to 10V, V
OUT
= 3.3V or 5V, I
Q
= 60µA, I
SD
= <1µA,
with Power On Reset S8 Package
LT1776 500mA (I
OUT
), 200kHz, High Efficiency Step-Down 90% Efficiency, V
IN
= 7.4V to 40V, V
OUT
= 1.24V, I
Q
= 3.2mA,
DC/DC Converter I
SD
= 30µA, N8,S8 Packages
LTC3250-1.5 250mA, 1.5MHz, High Efficiency, Step-Down Charge Pump 85% Efficiency, V
IN
= 3.1V to 5.5V, V
OUT
= 1.5V, I
Q
= 35µA,
I
SD
= <1µA, ThinSOT Package
LTC3251 500mA, 1MHz to 1.6MHz, Spread Spectrum, 85% Efficiency, V
IN
= 3.1V to 5.5V, V
OUT
= 0.9V to 1.6V,
Step-Down Charge Pump I
Q
= 9µA, I
SD
= <1µA, MS Package
LTC3404 600mA (I
OUT
), 1.4MHz, Synchronous Step-Down 95% Efficiency, V
IN
= 2.7V to 6V, V
OUT
= 0.8V, I
Q
= 10µA,
DC/DC Converter I
SD
= <1µA, MS8 Package
LTC3405A 300mA (I
OUT
), 1.5MHz, Synchronous Step-Down 95% Efficiency, V
IN
= 2.7V to 6V, V
OUT
= 0.8V, I
Q
= 20µA,
DC/DC Converter I
SD
= <1µA, ThinSOT Package
LTC3406B 600mA (I
OUT
), 1.5MHz, Synchronous Step-Down 95% Efficiency, V
IN
= 2.5V to 5.5V, V
OUT
= 0.6V, I
Q
= 20µA,
DC/DC Converter I
SD
= <1µA, ThinSOT Package
LTC3411 1.25A (I
OUT
), 4MHz, Synchronous Step-Down 95% Efficiency, V
IN
= 2.5V to 5.5V, V
OUT
= 0.8V, I
Q
= 60µA,
DC/DC Converter I
SD
= <1µA, MS Package
LTC3412 2.5A (I
OUT
), 4MHz, Synchronous Step-Down 95% Efficiency, V
IN
= 2.5V to 5.5V, V
OUT
= 0.8V, I
Q
= 60µA,
DC/DC Converter I
SD
= <1µA, TSSOP16E Package
LTC3440 600mA (I
OUT
), 2MHz, Synchronous Buck-Boost 95% Efficiency, V
IN
= 2.5V to 5.5V, V
OUT
= 2.5V, I
Q
= 25µA,
DC/DC Converter I
SD
= <1µA, MS Package
ThinSOT is a trademark of Linear Technology Corporation.
TYPICAL APPLICATIO
U
DC/DC Converter with Shutdown and Soft-Start
V
IN
C2
+
C2
–
GND
8
7
6
5
1
2
3
4
SS/SHDN
C1
+
V
OUT
C1
–
LTC1911-1.5
1µF*
1-CELL Li-Ion
OR
3-CELL NiMH
10µF*
10µF*
2N7002 ON OFF
10nF
1911 TA03
V
OUT
= 1.5V
I
OUT
= 250mA
1µF*
*CERAMIC CAPACITOR
2.7V TO 5.5V INPUT
RELATED PARTS
P1-P3P4-P6P7-P9P10-P12

LTC1911EMS8-1.8#PBF

Mfr. #:
Buy LTC1911EMS8-1.8#PBF
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators L N, Hi Eff, Inductorless Buck DC/DC Con
Lifecycle:
New from this manufacturer.
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