ITA25B3

Application information ITAxxB3
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2 Application information
This monolithic Transil Array is based on 610 unidirectional Transils with a common cathode
and can be configurated to offer up to 9 bidirectional functions. This imposes a maximum
differential voltage between 2 input pins (see Ta bl e 3 ).
Figure 8. RS-232 junction (typical application)
2.1 Design advantage of ITAxxB3 used with 4-point structure
Table 3. Maximum differential voltages
Order code Maximum differential voltage between two input pins at 25°C
ITA6V5B3 ± 3.5 v
ITA18B3 ± 9.0 v
ITA25B3 ± 12.5 v
TX
DTR
DSR
CARRIER DET.
AUX
CTS
RTS
RX
GND
The ITAxxxB3 has been designed with a 4-point structure
(separated Input/output) to efficiently protect against
disturbances with very high di/dt rates, such as ESD.
The purpose of this 4-point structure is to eliminate the
overvoltage introduced by the parasitic inductances of the
wiring (Ldi/dt).
Efficient protection depends not only on the component
itself, but also on the circuit layout. The drawing given in
figure 9 shows the layout to be used in order to take
advantage of the 4-point structure of the ITAxxxB3.
With this layout, each line to be protected passes through
the protection device.
In this way, it realizes an interface between the data line
and the circuit to be protected, guaranteeing an isolation
between its inputs and outputs.
Figure 9. The 4 point structure
U
Chip
Input 1
di/dt
GND
DEVICE TO BE
PROTECTED
GND
Output 1
ITAxxB3 Ordering information scheme
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3 Ordering information scheme
Figure 10. Ordering information scheme
ITA 25 B 3 RL
Integrated Transil Array
Breakdown Voltage (min)
Type of lines protected
Package
Packaging
25 = 25 Volt
B = Bidirectional
3 = SO-20
RL = Tape and reel
Blank = Tube
Package information ITAxxB3
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4 Package information
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 11. SO-20 footprint (dimensions in mm)
Table 4. SO-20 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 2.35 2.65 0.092 0.104
A1 0.10 0.30 0.004 0.008
B 0.33 0.51 0.013 0.020
C 0.23 0.32 0.009 0.013
D 12.6 13.0 0.484 0.512
E 7.40 7.60 0.291 0.299
e 1.27 0.050
H 10.0 10.65 0.394 0.419
h 0.25 0.75 0.010 0.029
L 0.40 1.27 0.016 0.050
K 8° (max)
EH
A
A1
B
e
D
K
hx45°
C
L
1.27 0.6
8.5
11.2

ITA25B3

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
ESD Suppressors / TVS Diodes 25V 300W Bidirect
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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