NVTFS5C680NLTAG

© Semiconductor Components Industries, LLC, 2016
August, 2017 − Rev. 2
1 Publication Order Number:
NVTFS5C680NL/D
NVTFS5C680NL
Power MOSFET
60 V, 26.5 mW, 20 A, Single N−Channel
Features
Small Footprint (3.3 x 3.3 mm) for Compact Design
Low R
DS(on)
to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
NVTFS5C680NLWF − Wettable Flanks Product
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage V
DSS
60 V
Gate−to−Source Voltage V
GS
±20 V
Continuous Drain
Current R
q
JC
(Notes 1, 2, 3, 4)
Steady
State
T
C
= 25°C
I
D
20
A
T
C
= 100°C 14
Power Dissipation
R
q
JC
(Notes 1, 2, 3)
T
C
= 25°C
P
D
20
W
T
C
= 100°C 10
Continuous Drain
Current R
q
JA
(Notes 1 & 3, 4)
Steady
State
T
A
= 25°C
I
D
7.82
A
T
A
= 100°C 6.54
Power Dissipation
R
q
JA
(Notes 1, 3)
T
A
= 25°C
P
D
3.0
W
T
A
= 100°C 2.1
Pulsed Drain Current
T
A
= 25°C, t
p
= 10 ms
I
DM
80 A
Operating Junction and Storage Temperature T
J
, T
stg
−55 to
+175
°C
Source Current (Body Diode) I
S
17 A
Single Pulse Drain−to−Source Avalanche
Energy (I
L(pk)
= 1 A)
E
AS
51 mJ
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)
T
L
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol Value Unit
Junction−to−Case − Steady State (Note 3)
R
q
JC
7.32
°C/W
Junction−to−Ambient − Steady State (Note 3)
R
q
JA
49
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which
substantially less than 100% of the heat flows to single case surface.
3. Surface−mounted on FR4 board using a 650 mm
2
, 2 oz. Cu pad.
4. Continuous DC current rating. Maximum current for pulses as long as 1
second is higher but is dependent on pulse duration and duty cycle.
www.onsemi.com
V
(BR)DSS
R
DS(on)
MAX I
D
MAX
60 V
26.5 mW @ 10 V
20 A
WDFN8
(m8FL)
CASE 511AB
MARKING DIAGRAM
42.5 mW @ 4.5 V
(Note: Microdot may be in either location)
1
XXXX = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
1
XXXX
AYWWG
G
D
D
D
D
S
S
S
G
N−Channel
D (5 − 8)
S (1, 2, 3)
G (4)
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
NVTFS5C680NL
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2
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Parameter
Symbol Test Condition Min Typ Max Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V
(BR)DSS
V
GS
= 0 V, I
D
= 250 mA
60 V
Zero Gate Voltage Drain Current I
DSS
V
GS
= 0 V,
V
DS
= 60 V
T
J
= 25°C 10 mA
T
J
= 125°C 100
Gate−to−Source Leakage Current I
GSS
V
DS
= 0 V, V
GS
= +20 V 100 nA
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V
GS(TH)
V
GS
= V
DS
, I
D
= 13 mA
1.2 2.2 V
Drain−to−Source On Resistance R
DS(on)
V
GS
= 10 V, I
D
= 10 A 22 26.5 mW
V
GS
= 4.5 V, I
D
= 10 A 34 42.5
Forward Transconductance g
FS
V
DS
= 15 V, I
D
= 10 A 20 S
CHARGES AND CAPACITANCES
Input Capacitance
C
iss
V
GS
= 0 V, f = 1.0 MHz,
V
DS
= 25 V
327
pF
Output Capacitance C
oss
161
Reverse Transfer Capacitance C
rss
6.0
Total Gate Charge Q
G(TOT)
V
GS
= 4.5 V, V
DS
= 48 V, I
D
= 10 A
2.9 nC
Threshold Gate Charge Q
G(TH)
0.8
nC
Gate−to−Source Charge Q
GS
1.2
Gate−to−Drain Charge Q
GD
0.8
Total Gate Charge Q
G(TOT)
V
GS
= 10 V, V
DS
= 48 V, I
D
= 10 A 6.0
nC
SWITCHING CHARACTERISTICS (Note 6)
Turn−On Delay Time
t
d(on)
V
GS
= 4.5 V, V
DS
= 48 V,
I
D
= 10 A, R
G
= 1.0 W
6.5
ns
Rise Time t
r
25
Turn−Off Delay Time t
d(off)
13
Fall Time t
f
23
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
V
SD
V
GS
= 0 V,
I
S
= 10 A
T
J
= 25°C 0.9 1.2
V
T
J
= 125°C 0.8
Reverse Recovery Time t
RR
V
GS
= 0 V, dl
S
/dt = 100 A/ms,
I
S
= 10 A
17
ns
Charge Time t
a
8.0
Discharge Time t
b
9.0
Reverse Recovery Charge Q
RR
7.0 nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. Pulse Test: Pulse Width 300 ms, Duty Cycle 2%.
6. Switching characteristics are independent of operating junction temperatures.
NVTFS5C680NL
www.onsemi.com
3
TYPICAL CHARACTERISTICS
0
5
10
15
20
25
30
012345
Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V) V
GS
, GATE−TO−SOURCE VOLTAGE (V)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
V
GS
, GATE−TO−SOURCE VOLTAGE (V) I
D
, DRAIN CURRENT (A)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
T
J
, JUNCTION TEMPERATURE (°C) V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
I
D
, DRAIN CURRENT (A)
I
D
, DRAIN CURRENT (A)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
R
DS(on)
, DRAIN−TO−SOURCE RESISTANCE (mW)
R
DS(on)
, NORMALIZED DRAIN−TO
SOURCE RESISTANCE
I
DSS
, LEAKAGE (nA)
2.6 V
3.0 V
T
J
= 125°C
T
J
= 25°C
T
J
= −55°C
T
J
= 25°C
I
D
= 10 A
T
J
= 25°C
V
GS
= 4.5 V
V
GS
= 10 V
V
GS
= 10 V
I
D
= 10 A
T
J
= 125°C
T
J
= 85°C
3.4 V
V
DS
= 10 V
T
J
= 150°C
V
GS
= 3.8 V to 10 V
2.8 V
3.2 V
0
5
10
15
20
25
30
0 0.5 1.0 1.5 2.0 2.5
3.6 V
20
25
30
35
40
45
50
34 5 6 7 8 910
50
56 8 910
40
30
25
20
15
7
0.6
0.8
1.0
1.4
1.6
1.8
2.2
−50 −25 0 25 50 75 100 125 150 175
0.01
100
1000
10000
100000
5152535
35
45
1.2
2.0
45 55
T
J
= 25°C
10
1
0.1

NVTFS5C680NLTAG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET AFSM T6 60V LL U8FL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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