OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

HLMP-Y801-JPP00

P1-P3
HLMP Y601/ Y651/Y701/Y801/ Y802/Y901/Y951
T-1 (3mm) AlInGaP LED Lamps
Data Sheet
Description
The following cumulative test results have been obtained
from testing performed at Avago Technologies in accor-
dance with the latest revision of JEDEC stds. Avago tests
parts at the absolute maximum rated conditions recom-
mended for the device. The actual performance you obtain
from Avago parts depends on the electrical and environ-
mental characteristics of your application but will prob-
ably be better than the performance outlined in Table 1.
Failure Rate Prediction
The junction temperature of the device determines the
failure rate of semiconductor devices. The relationship be-
tween ambient temperature and actual junction tempera-
ture is given by the following:
T
J
(°C) = T
A
(°C) + θ
JA
P
AVG
where
T
A
= ambient temperature in °C
θ
JA
= thermal resistance of junction-to-ambient in °C/Watt
P
AVG
= average power dissipated in Watt
The estimated MTBF and failure rate at temperatures lower
than the actual stress temperature can be determined by
using an Arrhenius model for temperature acceleration.
Results of such calculations are shown in the table below
using activation energy of 0.43V.
Table 1. Life Tests
Demonstrated Performance
Colors Stress Test Conditions
Total
Device Hrs
Units
Tested
Units
Failed
Performance in Time (60% condence)
MTBF
[1]
Failure Rate
(%/1K Hours)
Green/Yellow/Amber/Red/
DeepRed/Red Orange
T
A
= +75°C
If = 20mA
84,000 84 0 91700 1.091
2
Table 2. Reliability Predictions
Demonstrated Performance
Ambient
Temperature
(°C)
Junction
Temperature
[3]
(°C)
Performance in Time (60% Condence) Performance in Time (90% Condence)
MTBF
[1]
Failure Rate
[2]
(%/1K Hours) MTBF
Failure Rate
(%/1K Hours)
85 110 86100 1.161 34300 2.915
80 109 88800 1.126 35400 2.825
75 108 91700 1.091 36500 2.740
70 103 109100 0.917 43400 2.304
65 98 130500 0.766 52000 1.923
60 93 156900 0.637 62400 1.603
55 88 189500 0.528 75400 1.326
50 83 230200 0.434 91600 1.092
45 78 281200 0.356 111900 0.894
40 73 345400 0.290 137500 0.727
35 68 426800 0.234 169900 0.589
30 63 530800 0.188 211300 0.473
25 58 664600 0.150 264500 0.378
Notes:
[1] The 60% or 90% condence MTBF represents the minimum level of reliability performance which is expected from 60% or 90% of all samples. The
condence level is established based on the chi-square distribution.
[2] Failure rate (%/1K Hours) is 1/MTBF x 10
5
, assuming the failures are exponentially distributed.
[3] Data generated based on 55°C, 20mA and θJA = 780°C/W
Example of Failure Rate Calculation
Assume a device operating 8 hours/day, 5 days/week. The utilization factor, given 168hours/week is:
(8hous/day) x (5 days/week) / (168 hours/week) = 0.25
The point failure rate per year (8760 hours) at 75°C ambient temperature is:
(1.091% / 1K hours) x 0.25 x (8760 hours/year) = 2.39% per year
Similarly, 90% condence level failure rate per year at 75°C:
(2.74% / 1K hours) x 0.25 x (8760 hours/year) = 6.00% per year.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0935EN - December 28, 2007
Table 3. Environmental Tests
Test Name Test Conditions Units Tested Units Failed
Temperature Cycle -55°C/+100°C, 15 mins dwell,
5 mins transfer, 100 cycles
918 0
Low Temperature Operating Life -40°C, 20mA, 1000hrs 84 0
High Humidity and High
Temperature Operating Life
85°C/85%RH, 15mA, 1000hrs 84 0
High Humidity and High
Temperature Reverse Bias
85°C/85%RH, 5VRB, 500hrs 84 0
High Humidity and High
Temperature Storage Life
85°C/85%RH, 1000hrs 84 0
High Temperature Storage Life 100°C, 1000hrs 84 0
Low Temperature Storage Life -55°C, 1000hrs 84 0
Table 4. Other Tests
Test Name Test Conditions Units Tested Units Failed
Solder Heat resistance 260°C for 5 secs 66 0
Solderability 8 hrs steam age,
Solder dip at 245+/- 5°C, 5 secs
30 0
P1-P3

HLMP-Y801-JPP00

Mfr. #:
Buy HLMP-Y801-JPP00
Manufacturer:
Broadcom / Avago
Description:
Standard LEDs - Through Hole AllnGap Green
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet