74AHC_AHCT541_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 12 November 2007 12 of 16
NXP Semiconductors
74AHC541; 74AHCT541
Octal buffer/line driver; 3-state
Fig 9. Package outline SOT360-1 (TSSOP20)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153
99-12-27
03-02-19
w M
b
p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
74AHC_AHCT541_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 12 November 2007 13 of 16
NXP Semiconductors
74AHC541; 74AHCT541
Octal buffer/line driver; 3-state
Fig 10. Package outline SOT764-1 (DHVQFN20)
terminal 1
index area
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.6
4.4
D
h
3.15
2.85
y
1
2.6
2.4
1.15
0.85
e
1
3.5
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
29
19
12
11
10
1
20
X
D
E
C
B
A
terminal 1
index area
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
02-10-17
03-01-27
74AHC_AHCT541_3 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 03 — 12 November 2007 14 of 16
NXP Semiconductors
74AHC541; 74AHCT541
Octal buffer/line driver; 3-state
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
CDM Charged Device Model
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74AHC_AHCT541_3 20071112 Product data sheet 74AHC_AHCT541_2
Modifications:
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Section 3: DHVQFN20 package added.
Section 8: derating values added for DHVQFN20 package.
Section 12: outline drawing added for DHVQFN20 package.
74AHC_AHCT541_2
(939775006301)
19991124 Product specification 74AHC_AHCT541_1
74AHC_AHCT541_1
(939775004256)
19980921 Product specification -

74AHC541D,118

Mfr. #:
Manufacturer:
Nexperia
Description:
Buffers & Line Drivers OCTAL BUF/DRIVR 3-ST
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union