MC78L00A Series, NCV78L00A
www.onsemi.com
2
Figure 2. Standard Application
A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output
voltage even during the low point on the input ripple voltage.
* C
in
is required if regulator is located an appreciable distance from power supply filter.
** C
O
is not needed for stability; however, it does improve transient response.
MC78LXXA
Input
C
in
*
0.33 mF
C
O
**
0.1 mF
Output
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (5.0 V−9.0 V)
Input Voltage (12 V−18 V)
Input Voltage (24 V)
V
I
30
35
40
Vdc
Storage Temperature Range T
stg
−65 to +150 °C
Maximum Junction Temperature T
J
150 °C
Moisture Sensitivity Level MSL 1 −
ESD Capability, Human Body Model (Note 1) ESD
HBM
2000 V
ESD Capability, Machine Model (Note 1) ESD
MM
200 V
ESD Capability, Charged Device Model (Note 1) ESD
CDM
2000 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model.
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Package Dissipation PD Internally Limited W
Thermal Characteristics, TO−92
Thermal Resistance, Junction−to−Ambient
R
q
JA
200 °C/W
Thermal Characteristics, SOIC8
Thermal Resistance, Junction−to−Ambient
R
q
JA
Refer to Figure 8 °C/W
Thermal Characteristics, SOT−89
Thermal Resistance, Junction−to−Ambient
R
q
JA
55 °C/W
2. Thermal Resistance, Junction−to−Ambient depends on P.C.B. Copper area. See details in Figure 8.
Thermal Resistance, Junction−to−Case is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages
may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is
minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board.
