ESD7410, SZESD7410
www.onsemi.com
6
PACKAGE DIMENSIONS
X2DFN2 1.0x0.6, 0.65P
CASE 714AB
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. EXPOSED COPPER ALLOWED AS SHOWN.
A B
E
D
BOTTOM VIEW
b
L
0.10
C
TOP VIEW
0.05
C
A
A1
0.10 C
0.10 C
C
SEATING
PLANE
SIDE VIEW
DIM MIN MAX
MILLIMETERS
A 0.34 0.40
A1 −−− 0.05
b 0.45 0.55
D 1.00 BSC
E 0.60 BSC
SOLDER FOOTPRINT*
DIMENSIONS: MILLIMETERS
1.20
0.60
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
1
L 0.20 0.30
0.47
RECOMMENDED
PIN 1
PIN 1
INDICATOR
e 0.65 BSC
A
M
0.05 BC
A
M
0.05 BC
2X
e
e/2
2X
2X
NOTE 3
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