MP2361 – 2A, 23V, 1.4MHz STEP-DOWN CONVERTER
MP2361 Rev. 1.4 www.MonolithicPower.com 3
9/22/2011 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage (V
IN
)..................................... 25V
Switch Node Voltage (V
SW
) .......................... 26V
Bootstrap Voltage (V
BS
) ....................... V
SW
+ 6V
Feedback Voltage (V
FB
) .................–0.3V to +6V
Enable/UVLO Voltage (V
EN
)...........–0.3V to +6V
Comp Voltage (V
COMP
) ...................–0.3V to +6V
Continuous Power Dissipation (T
A
= +25°C)
(2)
QFN10 (3mmx3mm) .................................. 2.5W
MSOP10 .................................................. 0.83W
MSOP10E.................................................. 2.3W
SOIC8 ...................................................... 1.38W
Junction Temperature.............................+150°C
Lead Temperature ..................................+260°C
Storage Temperature.............. –65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage (V
IN
).......................4.75V to 23V
Operating Junct. Temp (T
J
).... –40°C to +125°C
Thermal Resistance
(4)
θ
JA
θ
JC
QFN10 (3mmx3mm)............... 50 ...... 12... °C/W
MSOP10 ................................ 150..... 65... °C/W
MSOP10E .............................. 55 ...... 12... °C/W
SOIC8..................................... 90 ...... 45... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance θ
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX)=(T
J
(MAX)-
T
A
)/ θ
JA
. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7 4-layer PCB.
