SI1012CR-T1-GE3

Vishay Siliconix
Si1012CR
Document Number: 67519
S13-0195-Rev. E, 28-Jan-13
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
N-Channel 20 V (D-S) MOSFET
FEATURES
TrenchFET
®
Power MOSFET: 1.2 V Rated
•100 % R
g
Te s t e d
Gate-Source ESD Protected: 1000 V
Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Load/Power Switching for Portable Devices
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories
Battery Operated Systems
Power Supply Converter Circuits
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 5 s.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
()I
D
(mA) Q
g
(Typ.)
20
0.396 at V
GS
= 4.5 V 600
0.75
0.456 at V
GS
= 2.5 V 500
0.546 at V
GS
= 1.8 V 350
1.100 at V
GS
= 1.5 V 50
Ordering Information:
Si1012CR-T1-GE3 (Lead (Pb)-free and Halogen-free)
Top View
2
1
S
D
G
3
SC-75A
Marking Code: K
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
20
V
Gate-Source Voltage
V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
a
T
A
= 25 °C
I
D
0.63
a, b
A
T
A
= 70 °C
0.5
a, b
Pulsed Drain Current (t = 300 µs)
I
DM
2
Continuous Source-Drain Diode Current
T
A
= 25 °C I
S
0.2
a, b
A
Maximum Power Dissipation
a
T
A
= 25 °C
P
D
0.24
a, b
W
T
A
= 70 °C
0.15
a, b
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b
t 5 s
R
thJA
440 530
°C/W
Steady State 540 650
www.vishay.com
2
Document Number: 67519
S13-0195-Rev. E, 28-Jan-13
Vishay Siliconix
Si1012CR
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
20 V
V
DS
Temperature Coefficient V
DS
/T
J
I
D
= 250 µA
17
mV/°C
V
GS(th)
Temperature Coefficient V
GS(th)
/T
J
- 1.8
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
0.4 1 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 8 V
± 30
µA
V
DS
= 0 V, V
GS
= ± 4.5 V
± 1
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 20 V, V
GS
= 0 V
1
V
DS
= 20 V, V
GS
= 0 V, T
J
= 85 °C
10
On-State Drain Current
a
I
D(on)
V
DS
= 5 V, V
GS
= 4.5 V 2 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 4.5 V, I
D
= 0.6 A
0.330 0.396
V
GS
= 2.5 V, I
D
= 0.3 A
0.380 0.456
V
GS
= 1.8 V, I
D
= 0.3 A
0.420 0.546
V
GS
= 1.5 V, I
D
= 0.05 A
0.720 1.100
Forward Transconductance
g
fs
V
DS
= 10 V, I
D
= 0.5 A
7.5 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
43
pFOutput Capacitance
C
oss
14
Reverse Transfer Capacitance
C
rss
8
Total Gate Charge
Q
g
V
DS
= 10 V, V
GS
= 8 V, I
D
= 0.6 A
1.3 2
nC
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 0.6 A
0.75 1.2
Gate-Source Charge
Q
gs
0.15
Gate-Drain Charge
Q
gd
0.13
Gate Resistance
R
g
f = 1 MHz 2.4 12.2 24.4
Tur n -O n D el ay Ti m e
t
d(on)
V
DD
= 10 V, R
L
= 20
I
D
0.5 A, V
GEN
= 4.5 V, R
g
= 1
11 20
ns
Rise Time
t
r
16 24
Turn-Off Delay Time
t
d(off)
26 39
Fall Time
t
f
11 20
Drain-Source Body Diode Characteristics
Pulse Diode Forward Current
a
I
SM
2A
Body Diode Voltage
V
SD
I
S
= 0.5 A
0.8 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 0.5 A, dI/dt = 100 A/µs
10 15 ns
Body Diode Reverse Recovery Charge
Q
rr
24nC
Reverse Recovery Fall Time
t
a
5
ns
Reverse Recovery Rise Time
t
b
5
Document Number: 67519
S13-0195-Rev. E, 28-Jan-13
www.vishay.com
3
Vishay Siliconix
Si1012CR
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
For technical questions, contact: pmostechsupport@vishay.com
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Gate Current vs. Gate-Source Voltage
Output Characteristics
On-Resistance vs. Drain Current
0
0.2
0.4
0.6
0.8
0 2 4 6 8 10 12 14
I
GSS
- Gate Current (mA)
V
GS
- Gate-Source Voltage (V)
T
J
= 25 °C
0
0.5
1
1.5
2
00.511.52
I
D
- Drain Current (A)
V
DS
- Drain-to-Source Voltage (V)
V
GS
= 5 V thru 2 V
V
GS
= 1 V
V
GS
= 1.5 V
0.20
0.40
0.60
0.80
00.511.52
R
DS(on)
- On-Resistance (Ω)
I
D
-Drain Current (A)
V
GS
= 1.8 V
V
GS
= 2.5 V
V
GS
= 4.5 V
Gate Current vs. Gate-Source Voltage
Transfer Characteristics
Capacitance
1.0E-09
1.0E-08
1.0E-07
1.0E-06
1.0E-05
1.0E-04
0 4 7 11 14
I
GSS
- Gate Current (A)
V
GS
- Gate-to-Source Voltage (V)
T
J
= 150 °C
T
J
= 25 °C
0
0.1
0.2
0.3
0.4
0.5
0 0.3 0.6 0.9 1.2 1.5
I
D
- Drain Current (A)
V
GS
- Gate-to-Source Voltage (V)
T
C
= 125 °C
T
C
= - 55 °C
T
C
= 25 °C
0
15
30
45
60
0 5 10 15 20
C - Capacitance (pF)
V
DS
- Drain-to-Source Voltage (V)
C
iss
C
oss
C
rss

SI1012CR-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 20V Vds 8V Vgs SC75A
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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