LTC3422
16
3422fa
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2005
LT 0406 REV A PRINTED IN USA
RELATED PARTS
PART NUMBER DESCRIPTION COMMENTS
LTC3400/LTC3400B 600mA (I
SW
), 1.2MHz, Synchronous Step-Up DC/DC 92% Efficiency, V
IN
: 0.85V to 5V, V
OUT(MAX)
= 5V, I
Q
= 19µA/300µA,
Converters I
SD
< 1µA, ThinSOT
TM
LTC3401 1A (I
SW
), 3MHz, Synchronous Step-Up DC/DC Converter 97% Efficiency, V
IN
: 0.5V to 5V, V
OUT(MAX)
= 5.5V, I
Q
= 38µA,
I
SD
< 1µA, MS10
LTC3402 2A (I
SW
), 3MHz, Synchronous Step-Up DC/DC Converter 97% Efficiency, V
IN
: 0.5V to 5V, V
OUT(MAX)
= 5.5V, I
Q
= 38µA,
I
SD
< 1µA, MS10
LTC3421 3A (I
SW
), 3MHz, Synchronous Step-Up DC/DC Converter 95% Efficiency, V
IN
: 0.5V to 4.5V, V
OUT(MAX)
= 5.25V, I
Q
= 12µA,
with Output Disconnect I
SD
< 1µA, QFN24
LTC3423/LTC3424 1A/2A (I
SW
), 3MHz, Synchronous Step-Up DC/DC 95% Efficiency, V
IN
: 0.5V to 5.5V, V
OUT(MAX)
= 5.5V, I
Q
= 38µA,
Converter I
SD
< 1µA, MSOP10
LTC3425 5A (I
SW
), 8MHz, (Low Ripple), 4-Phase Synchronous 95% Efficiency, V
IN
: 0.5V to 4.5V, V
OUT(MAX)
= 5.25V, I
Q
= 12µA,
Step-Up DC/DC Converter with Output Disconnect I
SD
< 1µA, QFN32
LTC3426 2A (I
SW
), 1.2MHz, Step-Up DC/DC Converter 92% Efficiency, V
IN
: 1.6V to 4.3V, V
OUT(MAX)
= 5V, I
SD
< 1µA, SOT-23
LTC3428 500mA (I
SW
), 1.25MHz/2.5MHz, Synchronous Step-Up 92% Efficiency, V
IN
: 1.8V to 5V, V
OUT(MAX)
= 5.25V, I
SD
< 1µA,
DC/DC Converter with Output Disconnect 2mm × 2mm DFN
LTC3429 600mA (I
SW
), 500kHz, Synchronous Step-Up DC/DC 96% Efficiency, V
IN
: 0.5V to 4.4V, V
OUT(MAX)
= 5V, I
Q
= 20µA/300µA,
Converter with Output Disconnect and Soft-Start I
SD
< 1µA, ThinSOT
LTC3525-3.3/ 400mA (I
SW
), Synchronous Step-Up DC/DC 94% Efficiency, V
IN
: 0.8V to 4.5V, V
OUT(MAX)
= 5.25V, I
Q
= 7µA,
LTC3525-5 Converter in SC70 Package I
SD
< 1µA, SC70
ThinSOT is a trademark of Linear Technology Corporation.
PACKAGE DESCRIPTIO
U
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD10) DFN 1103
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
