0.020
0.508
L2
DIMENSION IN MILLIMETERS
2.184
MIN.
A
S
Y
M
B
O
L
NOM.
2.286
MAX.
2.388
MAX.
DIMENSIONS IN INCHES
0.086
MIN. NOM.
0.090 0.094
0.005
-----
0.000
A1
0.000 0.127-----
0.0450.0410.035A2 0.889 1.1431.041
0.0350.0300.025b 0.635 0.8890.762
0.0450.0330.030b1 0.762 1.1430.840
0.0240.0200.018c 0.450 0.6100.508
0.0240.018c1 0.450 0.610
0.2450.2400.235
D
5.969 6.2236.096
0.2650.2600.250E 6.350 6.7316.604
e 2.286 BSC
e1 4.572 BSC
0.4100.3950.370H 9.398 10.41410.033
0.0800.0600.050
L
1.270 2.0321.520
L1
0.0500.0400.035L3 0.889 1.2701.016
0.090 BSC
0.180 BSC
b2 4.953 0.195
5.340
5.461 0.210 0.215
SEMICONDUCTOR, LTD.
ALPHA & OMEGA
NOTE
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND
GATE BURRS. MOLD FLASH SHOULD BE LESS THAN
6 MILS.
2. DIMENSION L IS MEASURED IN GAUGE PLANE
3. TOLERANCE 0.10 mm UNLESS OTHERWISE SPECIFIED
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED
INCH DIMENSIONS ARE NOT NECESSARILY EXACT.
5. REFER TO JEDEC TO-252 (AA)
UNIT: mm
RECOMMENDED LAND PATTERN
6.25 MIN.
6.80 MIN.
6.60
3.00 MIN.
1.50 MIN.
2.286
4.572 BSC
0.205D1 5.210
5.249 5.380
0.207
0.212
D2
0.762
0.030
0.170E1 4.318
0.070
E2
1.778
4.826
4.901
0.190
0.193
0.040-----0.025L4 0.635 1.016-----
0.115REF.2.921 REF.
0.508 0.020
0.408 0.608 0.0240.016
1.678 1.878
0.066 0.074
0.662 0.862
0.026 0.034
