STB80NF55L-08-1

1/9
PRELIMINARY DATA
March 2004
STP80NF55L-08
STB80NF55L-08 - STB80NF55L-08-1
N-CHANNEL 55V - 0.0065- 80A - TO-220/D
2
PAK/I
2
PAK
STripFET™ II POWER MOSFET
(1) Current Limited by Package
(2) I
SD
80A, di/dt 500A/µs, V
DD
=40VT
j
T
JMAX.
(3) Starting T
j
=25°C,I
D
=40A,V
DD
=40V
TYPICAL R
DS
(on) = 0.0065
LOW THRESHOLD DRIVE
LOGIC LEVEL DEVICE
DESCRIPTION
This Power Mosfet is the latest development of
STMicroelectronics unique “Single Feature
Size
™” strip-based process. The resulting tran-
sistor shows extremely high packing density for
low on-resistance, rugged avalance characteris-
tics and less critical alignment steps therefore a re-
markable manufacturing reproducibility.
APPLICATIONS
HIGH CURRENT SWITCHING APPLICATION
ABSOLUTE MAXIMUM RATINGS
( ) Pulse width limited by safe operating area
TYPE V
DSS
R
DS(on)
I
D
STP80NF55L-08
STB80NF55L-08
STB80NF55L-08-1
55 V
55 V
55 V
0.008
0.008
0.008
80 A
80 A
80 A
Symbol Parameter Value Unit
V
DS
Drain-source Voltage (V
GS
=0)
55 V
V
DGR
Drain-gate Voltage (R
GS
=20k)
55 V
V
GS
Gate- source Voltage ± 16 V
I
D
(1) Drain Current (continuous) at T
C
= 25°C
80 A
I
D
(1) Drain Current (continuous) at T
C
= 100°C
80 A
I
DM
( )
Drain Current (pulsed) 320 A
P
TOT
Total Dissipation at T
C
= 25°C
300 W
Derating Factor 2 W/°C
dv/dt (2) Peak Diode Recovery voltage slope 15 V/ns
E
AS
(3)
Single Pulse Avalanche Energy 870 mJ
T
stg
Storage Temperature –55 to 175 °C
T
j
Max. Operating Junction Temperature 175 °C
TO-220
1
2
3
1
3
D
2
PAK
1
2
3
I
2
PAK
INTERNAL SCHEMATIC DIAGRAM
STP80NF55L-08 - STB80NF55L-08 - STB80NF55L-08-1
2/9
THERMAL DATA
ELECTRICAL CHARACTERISTICS (T
CASE
=25°C UNLESS OTHERWISE SPECIFIED)
OFF
ON (1)
DYNAMIC
Rthj-case Thermal Resistance Junction-case Max 0.5 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose 300 °C
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 µA, V
GS
=0 55 V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
=0)
V
DS
=MaxRating
A
V
DS
= Max Rating, T
C
=125°C
10 µA
I
GSS
Gate-body Leakage
Current (V
DS
=0)
V
GS
= ± 16V ±100 nA
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage
V
DS
=V
GS
,I
D
=250µA
11.62.5V
R
DS(on)
Static Drain-source On
Resistance
V
GS
=10V,I
D
=40A
V
GS
=5V,I
D
=40A
0.0065
0.008
0.008
0.01
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
Forward Transconductance V
DS
=15V
,
I
D
=40 A
150 S
C
iss
Input Capacitance
V
DS
=25V,f=1MHz,V
GS
=0
4350 pF
C
oss
Output Capacitance 800 pF
C
rss
Reverse Transfer
Capacitance
260 pF
3/9
STP80NF55L-08 - STB80NF55L-08 - STB80NF55L-08-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
SWITCHING OFF
SOURCE DRAIN DIODE
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Turn-on Delay Time
V
DD
=27V,I
D
=40A
R
G
=4.7 V
GS
=4.5V
(see test circuit, Figure 3)
35 ns
t
r
Rise Time 145 ns
Q
g
Q
gs
Q
gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DD
=27.5V,I
D
= 80A,
V
GS
=4.5V
75
20
30
100 nC
nC
nC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
t
f
Turn-off-Delay Time
Fall Time
V
DD
=27V,I
D
=40A,
R
G
=4.7Ω, V
GS
=4.5V
(see test circuit, Figure 3)
85
65
ns
ns
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
Source-drain Current 80 A
I
SDM
(2)
Source-drain Current (pulsed) 320 A
V
SD
(2)
ForwardOnVoltage
I
SD
=80A,V
GS
=0
1.5 V
t
rr
Q
rr
I
RRM
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
I
SD
=80A,di/dt=100A/µs,
V
DD
=20V,T
j
= 150°C
(see test circuit, Figure 5)
85
280
6.5
ns
nC
A

STB80NF55L-08-1

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
MOSFET N-Ch, 55V-0.0065ohms 80A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet