NOTE 1.COPLANARITY OF SMT TERMINAL IS 0.1 MAX
NOTE 2.RECOMMENDED METAL MASK THICKNESS:120 um
NOTE 3.THE SHELL LENGTH IS LESS THAN THE MINIMUM SPECIFIED BY THE USB STANDARD.
AS SUCH IT CANNOT INDEPENDENTLY BE GUARANTEED TO MEET ALL TYPE C MECHANICAL REQUIREMENTS.
THE SYSTEM IMPLEMENTER IS RESPONSIBLE FOR ACHIEVING PRODUCT RELIABILITY AND PASSING USB COMPLIANCE TESTING.
REFERENCE THE USB TYPE C SPECIFICATION RELEASE 1.1,SECTION 3.2.1,NOTE7.
NOTE 4.LOT NUMBER IS MARKED AS INDIDATED.
YEAR (END OF DIGIT AT CHRISTIAN ERA)
MONTH (NUN. TO SEP.:1 TO 9, OCT.:O, NOV.:X, DEC.:Y)
DAY (TWO-DIGITS NUMBER)
EQUIPMENT No. (NUMBER OR ALPHABET)
(EX) 5 6 15 1
0
00
0 00
0.8 (B12)
1.2 (B11)
2 (B10)
2.4 (B9)
2.8 (B8)
3.2 (B7)
4 (B6)
4.4 (B5)
4.8 (B4)
5.2 (B3)
0.65
1.35
0.66
6 (B2)
6.4 (B1)
0.85 (A1)
1.35 (A2)
6.35 (A12)
1.85 (A3)
2.35 (A4)
2.85 (A5)
3.35 (A6)
3.85 (A7)
4.35 (A8)
4.85 (A9)
5.35 (A10)
5.85 (A11)
3.35
5.5
±0.2
6.05
6.65
±0.1
7.2
±0.05
00
1.4
4.4
6.05
1 8.2
1.6
(CENTER HEIGHT)
00
0
0
0.65
1.35
0.91
±0.15
0.85 (A1)
1.35 (A2)
1.85 (A3)
2.35 (A4)
2.85 (A5)
3.35 (A6)
3.85 (A7)
4.35 (A8)
4.85 (A9)
5.35 (A10)
5.85 (A11)
6.35 (A12)
0.8 (B12)
1.2 (B11)
2 (B10)
2.4 (B9)
2.8 (B8)
3.2 (B7)
4 (B6)
4.4 (B5)
4.8 (B4)
5.2 (B3)
6 (B2)
6.4 (B1)
0.7
-
0
0.3
(ALL T/H)
0.7
-
0
0.3
(BOSS)
1.4
0.8
4.4
6.9
0.8
X
10
YX
A
(10 : 1)
A1
Z
X Y
X Y0.05 Z
A2
Z0.05
0.05
Y
Z
0.75 ±0.025
12-1.1 ±0.03
12-0.3
±0.03
12- 0.4 ±0.05
±0.050.65
±0.025
0.75
0.95
±0.05
(5 : 1)
MATED CONDITION
MATING BOTTOM FACE
2.8
1.15
6.5 max.
MOUNTING CONDITION
(5 : 1)
3.34
TOP SURFACE OF BRACKET
Y Z
適合基板寸法(参考）
APPLICABLE P.C.B DIMENSION(REF.)
A1 A12
X0.1
ZYX0.05
ZYX0.05
ZY
0.1 X
A
2-1.6 ±0.05
2-1.6 ±0.05
±0.05
±0.052-2.1
2-0.6
1
8.2
1 8.2
±0.05
±0.05
2-1.1
±0.05
2-1.1
2-0.6
2-2.1 ±0.05
版数
VER.
年月日
D A T E
CN NO.
変 更 内 容
DESCRIPTION
製 図
DR.
担 当
CHK.
査 閲
APPD.
承 認
APPD.
FINISH PLATING THICKNESS
CONTACT AREA
GOLD FLASH
OVER PLLADIUM-NICKEL
OVER NICKEL
NICKEL:2μm MIN.
PALLADIUM-NICKEL:0.75μm MIN.
GOLD FLASH:0.05μm MIN.
SOLDER TALES GOLD FLASH OVER NICKEL
NICKEL:2μm MIN.
GOLD FLASH:0.03μm MIN.
TABLE 1
A12 GND B1 GND
A11 SSRXp2 B2 SSTXp2
A10 SSRXn2 B3 SSTXn2
A9 VBUS B4 VBUS
A8 SUB1 B5 CC2
A7 Dn1 B6 Dp2
A6 Dp1 B7 Dn2
A5 CC1 B8 SUB2
A4 VBUS B9 VBUS
A3 SSTXn1 B10 SSRXn1
A2 SSTXp1 B11 SSRXp1
A1 GND B12 GND
PIN SIGNAL NAME PIN SIGNAL NAME
TABLE 2. PIN DEFINE
符号
NO.
名 称
DESCRIPTION
個 数
QTY.
材 料
MATERIAL
仕 上
FINISH
備 考
REMARKS
10 REAR SHIELD 1 STAINLESS STEEL NICKEL PLATING PLATING THICKNESS:1μm Min.
9 LOCATOR 1 THERMOPLASTIC RESIN COLOR:BLACK HALOGEN-FREE
8 BRACKET 1 STAINLESS STEEL NICKEL PLATING PLATING THICKNESS:1μm Min.
7 SHELL 1 STAINLESS STEEL BLACK NICKEL PLATING PLATING THICKNESS:1μm Min.
6 GND PLATE 2 STAINLESS STEEL NICKEL PLATING PLATING THICKNESS:0.8μm Min.
5 GND MID PLATE 1 STAINLESS STEEL NICKEL PLATING PLATING THICKNESS:1μm Min.
4 INSULATOR 1 THERMOPLASTIC RESIN COLOR:BLACK HALOGEN-FREE
3 CONTACT C 6 COPPER ALLOY TABLE 1
2 CONTACT B 6 COPPER ALLOY TABLE 1
1 CONTACT A 12 COPPER ALLOY TABLE 1
5 6 15 1
図面番号(DRAWING NO.)
DCF-C-213H(12.08)
．
．
±
±
．
±
．
±
’
±
±
°
°
0.1
0.4
0.8
SIZE A2
DX07S024XJ1
S/W
SJ116123
1
SJ116123
DX07
5:1
JAE Connector DIV. Proprietary.Copyright(C) 2015, Japan Aviation Electronics Industry, LTD.
―
M.SASAKI
16/JUN/2015
100
9080
70
60
504030
2010
0
仕様書(SPECIFICATION)
T.MASUMOTO
一般公差(GENERAL TOLERANCE)
寸法(DIMENSION)
単位(UNIT)：㎜
角度(ANGLES)
APPD.
承認
APPD.
査閲
CHK.
担当
DR.
第1版(ORIGINAL DATE) シリーズ(SERIES)尺度(SCALE)
名称(TITLE)
質量(MASS)
(VER.)
版数
日本航空電子工業株式会社
製図
INDUSTRY,LTD.
JAPAN AVIATION
ELECTRONICS
図面番号(DRAWING NO.)
CA-B
4
A1 A12
B12 B1
6
5
D0.35
M
C
±0.087.2
0.6
±0.025
0.02
0.06
-
+
8.34
0.02
+0.06
-2.54
4-0.2 ±0.03
LOT NO.(NOTE.4)
9.39
9.65
3
1
2
7
9
A
A-BM D
CA-BM0.15
DCA-BM0.1
0.15
B
12-0.12 ±0.03
±0.0512-0.2
12-0.15
±0.05
8
0.3 M A-B
0.3
M
A-B
2-1.2
±0.05
2-1.2
±0.05
