Data Sheet OP200
Rev. G | Page 7 of 16
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage ±20 V
Differential Input Voltage ±30 V
Input Voltage Supply voltage
Output Short-Circuit Duration Continuous
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
Junction Temperature Range (T
J
) −65°C to +150°C
Operating Temperature Range
OP200A −55°C to +125°C
OP200E, OP200G −40°C to +85°C
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Table 6.
Package Type θ
JA
1
θ
JC
Unit
8-Lead CERDIP (Z Suffix) 148 16 °C/W
8-Lead Plastic DIP (P Suffix) 96 37 °C/W
16-Lead SOIC (S Suffix) 92 27 °C/W
1
θ
JA
is specified for worst-case mounting conditions, that is, θ
JA
is specified for
device in socket for CERDIP and PDIP packages; θ
JA
is specified for device
soldered to printed circuit board for SOIC package.
ESD CAUTION
