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2-1470213-8

P1-P3P4-P5
Product
Specification
108-57197
24-MAR-2006 Rev B
AMPMODU, 2.0mm PITCH BOARD-TO-BOARD
CONNECTOR
DR DATE
CHK DATE
Oblic Hu 24-Mar-2006
Wei-Jer Ke 24-Mar-2006
. This specification is a controlled document.
1 of 5
LOC DW
TYCO Holdings (Bermuda) VII LTD.
Taiwan Branch
3F, No. 45, Dongsing Road,
Taipei,11070, Taiwan. ROC.
TEL : 886-2-8768-2788
1. SCOPE
1.1.
1.1. CONTENTS
This specification covers the performance, tests and quality requirements for the
AMPMODU, 2.0mm PITCH BOARD-TO-BOARD CONNECTOR.
1.2. 1.2. QUALIFICATION
When tests are performed on the subject product line, the procedures specified in
Tyco 109 series specifications shall be used. All inspections shall be performed
using the applicable inspection plan and product drawing.
2. APPLICABLE DOCUMENTS AND SPECIFICATIONS
The following documents form a part of this specification to the extent specified
herein. In the event of conflict between the requirements of this specification and
the product drawing, the product drawing shall take precedence. In the event of
conflict between the requirements of this specification and the referenced
documents, this specification shall take precedence.
2.1. 2.1 TYCO SPECIFICATIONS
A. 109-1: General Requirements for Test Specifications
B. 109 series: Test Specification as indicated in figure 2 (Comply with MIL-STD-202)
C. Corporate Bulletin 401-76: Cross-reference between Tyco test Specifications and Military or
Commercial Documents.
D. 501-57197: Test Report.
3. REQUIREMENTS
3.1. DESIGN AND CONSTRUCTION
Product shall be of the design, construction and physical dimensions specified on the
applicable product drawing.
3.2. MATERIALS
A. Housing：Thermoplastic or Thermoplastic High Temp., UL94V-0.
B. Contact：Copper Alloy, Gold plating on contact area, Tin or Tin-Lead Plating on soldertail over
Nickel underplating overall.
108-57197
Rev
B 2 of 5
3.3. RATINGS
A. Voltage: 250 VAC rms.
B. Current: 1 A Max
C. Operating Temperature: -40°C to + 105°C
3.4. PERFOMANCE AND TEST DESCRIPTION
The product is designed to meet the electrical, mechanical and environmental
performance requirements specified in Table 2. All tests are performed at
ambient environmental conditions per AMP Specification 109-1 unless otherwise
specified.
3.5. TEST REQUIREMENTS AND PROCEDURES SUMMARY
NO. TEST ITEMS REQUIREMENTS PROCEDURES
3.5.1 Examination of
Product
Meets requirements of product
drawing. No physical damage.
Visual inspection.
ELECTRICAL REQUIREMENTS
Initial 20m ohms max.
3.5.2.1
Termination
Resistance
Final 30m ohms max.
Subject mated contacts assembled in
housing to closed circuit current of 50mA
max at open circuit voltage of 50mV max.
(See Fig. 1)
3.5.2.2
Insulation
Resistance
1000M ohms min. (Initial)
1000M ohms min (Final)
Measure by applying test potential between
adjacent contacts, and between the
contacts and ground in the mated connector
assembly.
MIL-STD-202, Method 302, Condition B
3.5.2.3
Dielectric Strength
Connector must withstand test
potential of 650VAC for 1 min.
Current leakage limit to 5.0mA
max.
Measure by applying test potential between
adjacent contacts, and between the
contacts and ground in the mated connector
assembly.
MIL-STD-202, Method 301
MECHANICAL REQUIREMENTS
Insertion Force
Extraction
Force
3.5.3.1
Individual Pin
Insertion/ Extraction
Force
200 gf max 10gf min
Subject terminated contact and pin to mate
and unmate to measure the force required
to insert and extract by operating at a rate of
100mm a minute. (See Fig. 2)
3.5.3.2
Receptacle Contact
Retention Force
250 gf min. per contact Apply axial load to terminated contact at a
rate of 25mm a minute.
3.5.3.3
Post Retention
Force
0.5 kgf min. per contact Apply axial pull-off load to post contact
mounted on housing and measure the force
required to dislodge post from housing.
3.5.3.4
Solder ability
The inspected area of each lead
must have 95% solder coverage
minimum.
Steam Aging Preconditioning：
(1) Tin、Tin-Cu Coating:
93+3/-5℃、100% HR、8hrs.
<J-STD-002 category 3 aging>
(2) Other Coating:
93+3/-5℃、100% HR、1hrs.
<J-STD-002 category 2 aging>
Solder pot temperature: 245±5℃, 5sec
108-57197
Rev
B 3 of 5
NO. TEST ITEMS REQUIREMENTS PROCEDURES
ENVIRONMENTAL REQUIREMENTS
3.5.4.1
Vibration
No electrical discontinuity greater
than 1 microsecond.
Subject mated connectors to 10-55-10 Hz
traversed in 1minutes at 1.52mm amplitude 2
Hours each of 3 mutually perpendicular
planes.
MIL-STD-202, Method201, Condition A
3.5.4.2
Temperature Life
(Heat Aging)
Termination resistance (low level)
shall be met.
Termination resistance 40m
ohms Max.
Subject mated connector assemblies to
temperature life at 85°C±2°C for 96 hours.
3.5.4.3
Humidity, Steady
State
Insulation Resistance (Final)
500M ohms min.
Termination resistance (low level)
shall be met.
Subject mated connectors to steady state
humidity at 40°C±2°C and 90-95% R.H for 96
hrs.
3.5.4.4
Thermal Shock Termination resistance (low level)
shall be met.
Subject mated connector assemblies on 5
cycle –55 °C and +80°C for 30 minutes each
duration at temperature extremes.
MIL-STD-202, Method 107, Condition A
3.5.4.5
Resistance to
Soldering Heat
No Physical damage Subject connector mounted on printed circuit
boards to solder bath at 260±5°C for 5±1
seconds (Flow soldering).
MIL-STD-202, Method 210, Condition C.
3.5.4.6
Durability (Repeated
Mate /Unmating)
Termination resistance (low level)
shall be met.
Subject connector assembly to 50 cycles of
repeated mating /unmating at a rate of 10
cycles a minute.
3.5.4.7
Salt Spray
30mΩ Max. (Final)
Exposing in a heat chamber at a temperature
of 35°C ±2°C for 24 hours.
EIA-364-26A, CONDIION A.
Resistance to Wave
Soldering Heat
No physical damage shall occur.
Solder Temp. : 240±5℃, 10±0.5sec.
Tyco spec. 109-202, Condition A
Resistance to Wave
Soldering Heat
No physical damage shall occur.
Solder Temp. : 265±5℃, 10±0.5sec.
Tyco spec. 109-202, Condition B
Resistance to Wave
Soldering Heat
No physical damage shall occur.
Solder Temp. : 260±5℃, 10±0.5sec.
Tyco spec. 109-202, Condition C
Resistance to
Reflow Soldering
Heat
No physical damage shall occur.
Pre-soak condition, 85℃/85﹪RH for 168
hours.
Pre Heat: 150~180℃, 90±30sec.
Heat: 230℃ Min., 30±10sec.
Peak Temp. : 245+0/-5℃, 10~30sec.
Duration: 3 cycles
Tyco spec. 109-201, Condition A
3.4.5.8
Resistance to
Reflow Soldering
Heat
No physical damage shall occur.
Pre-soak condition, 85℃/85﹪RH for 168
hours.
Pre Heat: 150~180℃, 90±30sec.
Heat: 230℃ Min., 30±10sec.
Peak Temp. : 260+0/-5℃, 20~40sec.
Duration: 3 cycles
Tyco spec. 109-201, Condition B
Figure 1
P1-P3P4-P5

2-1470213-8

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Manufacturer:
TE Connectivity / AMP Connectors
Description:
Board to Board & Mezzanine Connectors OBSOLETE
Lifecycle:
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