Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for com-
munications, defense and security, aerospace, and industrial markets. Products include high-performance and radiation-
hardened analog mixed-signal integrated circuits, FPGAs, SoCs, and ASICs; power management products; timing and
synchronization devices and precise time solutions; voice processing devices; RF solutions; discrete components; enter-
prise storage and communications solutions, security technologies, and scalable anti-tamper products; Ethernet solutions;
Power-over-Ethernet ICs and midspans; custom design capabilities and services. Microsemi is headquartered in Aliso Viejo,
California, and has approximately 4,800 employees worldwide. Learn more at www.microsemi.com.
Microsemi Corporate Headquarters
One Enterprise, Aliso Viejo, CA 92656 USA
Within the USA: +1 (800) 713-4113
Outside the USA: +1 (949) 380-6100
Sales: +1 (949) 380-6136
Fax: +1 (949) 215-4996
email: sales.support@microsemi.com
www.microsemi.com
©2015–2016 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are registered trademarks of Microsemi Corporation. All other trademarks
and service marks are the property of their respective owners.
V
PPD-03916. 1.0. 4/16
EcoEthernet v2.0 Energy Effi ciency
• ActiPHY
• PerfectReach
• IEEE 802.3az Energy Effi cient Ethernet
• Integrated LED brightness control
• Fully optimized power consumption for all link speeds
• 10BASE-Te support according to IEEE 802.3az
Superior PHY and Interface Technology
• Four integrated 10/100/1000BASE-T Ethernet copper
transceivers (IEEE 802.3ab-compliant) with VeriPHY™ cable
diagnostics
• QSGMII SerDes MAC interface
• Patented line driver with low EMI voltage mode and integrated
line side termination resistors
• HP Auto-MDIX support and forced MDI/MDIX option
• Jumbo frame support up to 16 kB with programmable
synchronization FIFOs
• IEEE 802.3bf register support provides standardized access to
information about data delay between the MDI and xMII inter-
face for a given PHY
Key Specifi cations
• 1.0 V and 2.5 V power supplies
• 3.3 V-tolerant 2.5 V inputs (single-ended and bi-directional TTL/
CMOS I/Os)
• QSGMII v1.3 and IEEE 1149.1 JTAG boundary scan
• IEEE 802.3 10BASE-T/Te, 100BASE-TX, and 1000BASE-T
compliance
• 12 mm x 12 mm, 138-pin multi-row QFN package
• VSC8514-11 operature temperature: 0 °C to 125 °C
• VSC8514-14 operating temperature: –40 °C to 125 °C
VSC8514-11
Quad Port Gigabit Copper EEE PHY with QSGMII MAC-to-PHY Interface
VSC8514-11
COMA_MODE
NRESET
MDC
MDIO
MDINT
PHYADD[4:2]
RDP_0
RDN_0
TDP_0
TDN_0
P0_D[3:0]N
P0_D[3:0]P
P1_D[3:0]N
P1_D[3:0]P
P2_D[3:0]N
P2_D[3:0]P
P3_D[3:0]N
P3_D[3:0]P
REFCLK_P/N
REFCLK_SEL0
REFCLK_SEL1
REF_FILT_A
REF_REXT_A
SerDes_Rext_[1:0]
LED[3]_[0:3]
LED[2]_[0:3]
LED[1]_[0:3]
LED[0]_[0:3]
TMS
TRST
TCK
TDI
TDO
GPIO[14:10]
Serial MAC Interface (QSGMII)
Autonegotiation (QSGMII, FIFOs)
10/100/
1000BASE-T
PCS
10/100/
1000BASE-T
PMA
MDI
Twisted
Pair
Interface
GPIO
PLL
and
Analog
LED
Interface
JTAG
Management
and
Control
Interface
(MIIM)