- Fast switching speed
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin(Sn) lead finish with Nickel(Ni) underplate
- Pb free and RoHS compliant
- Green compound (Halogen free) with suffix "G" on
packing code and prefix "G" on date code
- Case: SOT-23 small outline plastic package
- Terminal: Matte tin plated, lead free,
solderable per MIL-STD-202, Method 208 guaranteed
- High temperature soldering guaranteed: 260
o
C/10s
- Weight: 0.008grams (approximately)
P
D
mW
V
RRM
V
I
FRM
mA
I
O
mA
R
θJA
o
C/W
T
J
, T
STG
o
C
V
(BR)
V
I
R
µA
pF
pF
t
rr
ns
Document Number: DS_S1404011
2
Junction capacitance
BAW56, BAV70
V
R
= 0 V,
f = 1 MHz
BAV99
C
J
I
F
= 150 mA
V
R
= 70 V
225mW SMD Switching Diode
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (T
A
=25℃ unless otherwise noted)
Pulse Width=1 µsec
Reverse revovery time I
F
= I
R
= 10 mA, R
L
= 100 Ω, I
RR
= 1 mA
Reverse breakdown voltage
I
R
= 100 µA
I
F
= 50 mA
-
2.50
1.5
6
70 -
-
-
1.25-
-
- 55 to + 150
1.00
-
556
V
F
Forward voltage
I
FSM
450
Small Signal Product
Taiwan Semiconductor
SOT-23
70
2
0.5
Mean forward current 200
Power dissipation
Repetitive peak forward current
Non-repetitive peak forward
surge current
Version: H14
Pulse Width=1 sec
225
Reverse leakage current
A
Peak repetitive reverse voltage
Junction and storage temperature range
Thermal resistance form junction to ambient
V
