© Semiconductor Components Industries, LLC, 2012
April, 2017 − Rev. 5
1 Publication Order Number:
MBRS3100T3/D
MBRS3100T3G,
NRVBS3100T3G
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Features
• Small Compact Surface Mountable Package with J−Bend Leads
• Rectangular Package for Automated Handling
• Highly Stable Oxide Passivated Junction
• Excellent Ability to Withstand Reverse Avalanche Energy Transients
• Guard−Ring for Stress Protection
• NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 217 mg (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Polarity: Notch in Plastic Body Indicates Cathode Lead
• ESD Ratings:
♦ Machine Model = C
♦ Human Body Model = 3B
Device
Package
Shipping
†
ORDERING INFORMATION
SMC 2−LEAD
CASE 403AC
SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES, 100 VOLTS
www.onsemi.com
B310 = Specific Device Code
A = Assembly Location**
Y = Year
WW = Work Week
G = Pb−Free Package
MARKING DIAGRAM
MBRS3100T3G SMC 2−Lead
(Pb−Free)
2,500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
(Note: Microdot may be in either location)
NRVBS3100T3G* SMC 2−Lead
(Pb−Free)
2,500 /
Tape & Reel
AYWW
B310G
G
** The Assembly Location code (A) is front side
optional. In cases where the Assembly Location i
stamped in the package, the front side assembly
code may be blank.