MP2227 – 24V, 3A, 1.3MHz SYNCHRONOUS STEP-DOWN CONVERTER
MP2227 Rev. 1.1 www.MonolithicPower.com 2
11/21/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking Free Air Temperature (T
A
)
MP2227DQ
QFN10(3mm x 3mm)
7U
-40C to +85C
* For Tape & Reel, add suffix –Z (e.g. MP2227DQ–Z).
For RoHS Compliant packaging, add suffix –LF (e.g. MP2227DQ–LF–Z)
PACKAGE REFERENCE
TOP VIEW
FB
POK
VIN
GND
GND
1
2
3
4
5
EN/SYNC
VCC
BST
SW
SW
10
9
8
7
6
EXPOSED PAD
ON BACKSIDE
ABSOLUTE MAXIMUM RATINGS
(1)
VIN to GND...................................-0.3V to +28V
SW to GND ...........................-0.3V to V
IN
+ 0.3V
.............................-2.5V to V
IN
+ 2.5V for < 50ns
FB, EN/SYNC, VCC to GND...........-0.3V to +6.5V
POK, SYNC_OUT to GND .............-0.3V to +6.5V
BS to SW .....................................-0.3V to +6.5V
Continuous Power Dissipation (T
A
= +25°C)
(2)
………………………………………………....2.5W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage V
IN
..............................3V to 24V
Output Voltage V
OUT
..................0.8V to 0.9 x V
IN
Max Operating Junct. Temp (T
J
).............+125°C
Thermal Resistance
(4)
θ
JA
θ
JC
QFN10 (3mm x 3mm) .............50 ...... 12... C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance θ
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/θ
JA
. Exceeding the maximum allowable powe
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.