19
LTC3444
3444fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
LTC3444
3.1V TO 4.4V
SW2
R1
340k
C
OUT
4.7μF
2.2μH
L1
C
IN
4.7μF
V
OUT
3.3V AT 400mA
R2
200k
V
OUT
FB
V
C
SW1
V
IN
SHDN
GND
+
3444 TA04
Li-Ion
C
IN
=
C
OUT
=
L1 =
MURATA:GRM31CR61C475K
MURATA:GRM31CR61C475K
COOPER BUSSMAN SD12-2R2
Single Li-Ion, 3.1V to 4.2V Input, 3.3V at 400mA
Output with Internal Compensation
TYPICAL APPLICATIO S
U
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
20
LTC3444
3444fb
© LINEAR TECHNOLOGY CORPORATION 2005
LT 0507 REV B • PRINTED IN THE USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
FAX: (408) 434-0507
www.linear.com
PART NUMBER DESCRIPTION COMMENTS
LTC3403 1.5MHz, 600mA, Synchronous Step-Down Regulator 96% Efficiency, V
IN
: 2.5V to 5V, V
OUT
: 0.3V to 3.5V,
with Bypass Transistor I
SD
<1μA, (3mm × 3mm) DFN Package
LTC3408 1.5MHz, 600mA, Synchronous Step-Down Regulator 96% Efficiency, V
IN
: 2.5V to 5V, V
OUT
: 0.3V to 3.5V,
with Bypass Transistor I
SD
<1μA, (3mm × 3mm) DFN Package
LTC3440 Up to 2MHz, 600μA, Synchronous Buck-Boost 95% Efficiency, V
IN
: 2.5V to 5.5V, V
OUT(MIN)
= 2.5V,
DC/DC Converter I
SD
<1μA, I
Q
= 25μA, 10-Lead MS Package
LTC3441 1MHz, 1.2A, Synchronous Buck-Boost 95% Efficiency, V
IN
: 2.5V to 5.5V V
OUT(MIN)
= 2.5V,
DC/DC Converter I
SD
<1μA, I
Q
= 25μA, 12-Lead (4mm × 3mm) DFN Package
LTC3442 Up to 2MHz, 1.2A, Synchronous Buck-Boost 95% Efficiency, V
IN
: 2.5V to 5.5V, V
OUT(MIN)
= 2.5V,
DC/DC Converter I
SD
<1μA, I
Q
= 25μA, 12-Lead (4mm × 3mm) DFN Package
LTC3443 600MHz, 1.2A Synchronous Buck-Boost 95% Efficiency, V
IN
: 2.5V to 5.5V, V
OUT(MIN)
= 2.5V,
DC/DC Converter I
SD
<1μA, I
Q
= 25μA, 12-Lead (4mm × 3mm) DFN Package
RELATED PARTS
Externally Compensated WCDMA Application. Singe Cell,
3.1V to 4.2V Input, 0.8V to 4.2V at 400mA Output.
LTC3444
V
CONTROL
3.1V TO 4.2V
SW2
R4
47.5k
C
OUT
4.7μF
3.3μH
L1
C
IN
4.7μF
V
OUT
0.8V TO 4.2V
R3
205k
R2
267k
R1
340k
R5
47.5k
C2
220
pF
C3
10
pF
C1
10
pF
V
OUT
FB
V
C
SW1
V
IN
SHDN
GND
DAC
+
Li-Ion
3444 TA03
C
IN
=
C
OUT
=
L1 =
MURATA:GRM31CR61C475K
MURATA:GRM31CR61C475K
COOPER BUSSMAN SD12-3R3
U
TYPICAL APPLICATIO

LTC3444EDD#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Micropower Sych Buck-Boost DC/DC Converter
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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