MCR8SD

© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 5
1 Publication Order Number:
MCR8S/D
MCR8SDG, MCR8SMG,
MCR8SNG
Sensitive Gate Silicon
Controlled Rectifiers
Reverse Blocking Thyristors
Designed primarily for half-wave ac control applications, such as
motor controls, heating controls, and power supplies; or wherever
half−wave, silicon gate−controlled devices are needed.
Features
Sensitive Gate Allows Triggering by Microcontrollers and other
Logic Circuits
Blocking Voltage to 800 V
On−State Current Rating of 8 A RMS at 80°C
High Surge Current Capability − 80 A
Rugged, Economical TO−220AB Package
Glass Passivated Junctions for Reliability and Uniformity
Minimum and Maximum Values of IGT, VGT and IH Specified for
Ease of Design
Immunity to dv/dt − 5 V/msec Minimum at 110°C
These are Pb−Free Devices*
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating Symbol Value Unit
Peak Repetitive Off−State Voltage (Note 1)
(T
J
= −40 to 110°C, Sine Wave,
50 to 60 Hz) MCR8SDG
MCR8SMG
MCR8SNG
V
DRM,
V
RRM
400
600
800
V
On-State RMS Current
(180° Conduction Angles; T
C
= 80°C)
I
T(RMS)
8.0 A
Peak Non-Repetitive Surge Current
(1/2 Cycle, Sine Wave, 60 Hz, T
J
= 110°C)
I
TSM
80 A
Circuit Fusing Consideration (t = 8.33 ms) I
2
t 26.5 A
2
sec
Forward Peak Gate Power
(Pulse Width 10 ms, T
C
= 80°C)
P
GM
5.0 W
Forward Average Gate Power
(t = 8.3 ms, T
C
= 80°C)
P
G(AV)
0.5 W
Forward Peak Gate Current
(Pulse Width 10 ms, T
C
= 80°C)
I
GM
2.0 A
Operating Junction Temperature Range T
J
−40 to 110 °C
Storage Temperature Range T
stg
−40 to 150 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. V
DRM
and V
RRM
for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; positive gate voltage shall not be
applied concurrent with negative potential on the anode. Blocking voltages
shall not be tested with a constant current source such that the voltage ratings
of the devices are exceeded.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
SCRs
8 AMPERES RMS
400 thru 800 VOLTS
TO−220AB
CASE 221A−09
STYLE 3
1
www.onsemi.com
MARKING
DIAGRAM
A = Assembly Location
Y = Year
WW = Work Week
x = D, M, or N
G = Pb−Free Package
AKA = Diode Polarity
2
3
Device Package Shipping
ORDERING INFORMATION
MCR8SDG TO−220AB
(Pb−Free)
50 Units / Rail
MCR8SNG TO−220AB
(Pb−Free)
50 Units / Rail
MCR8SMG TO−220AB
(Pb−Free)
50 Units / Rail
K
G
A
PIN ASSIGNMENT
1
2
3
Anode
Gate
Cathode
4
Anode
AY WW
MCR8SxG
AKA
MCR8SDG, MCR8SMG, MCR8SNG
www.onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction−to−Case
Junction−to−Ambient
R
q
JC
R
q
JA
2.2
62.5
°C/W
Maximum Lead Temperature for Soldering Purposes 1/8 from Case for 10 Seconds T
L
260 °C
ELECTRICAL CHARACTERISTICS (T
J
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current (Note 3)
(V
D
= Rated V
DRM
and V
RRM
; R
GK
= 1 kW)T
J
= 25°C
T
J
= 110°C
I
DRM
,
I
RRM
10
500
mA
ON CHARACTERISTICS
Peak Forward On−State Voltage (Note 2)
(I
TM
= 16 A)
V
TM
1.8 V
Gate Trigger Current (Continuous dc) (Note 4)
(V
D
= 12 V; R
L
= 100 W)
I
GT
5.0 25 200
mA
Holding Current (Note 3)
(V
D
= 12 V, Gate Open, Initiating Current = 200 mA)
I
H
0.5 6.0 mA
Latch Current (Note 4)
(V
D
= 12 V, I
G
= 200 mA)
I
L
0.6 8.0 mA
Gate Trigger Voltage (Continuous dc) (Note 4) T
J
= 25°C
(V
D
= 12 V; R
L
= 100 W)T
J
= *40°C
V
GT
0.3
0.65
1.0
1.5
V
Gate Non−Trigger Voltage T
J
= 110°C
(V
D
= 12 V, R
L
= 100 W)
V
GD
0.2 V
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Off−State Voltage
(V
D
= 67% V
DRM
, R
GK
= 1 KW, C
GK
= 0.1 mF, T
J
= 110°C)
dv/dt 5.0 15
V/ms
Critical Rate of Rise of On−State Current
IPK = 50 A, Pw = 40 msec, diG/dt = 1 A/msec, Igt = 10 mA
di/dt 100
A/ms
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Indicates Pulse Test: Pulse Width v 2.0 ms, Duty Cycle v 2%.
3. R
GK
= 1000 Ohms included in measurement.
4. Does not include R
GK
in measurement.
MCR8SDG, MCR8SMG, MCR8SNG
www.onsemi.com
3
+ Current
+ Voltage
V
TM
I
DRM
at V
DRM
I
H
Symbol Parameter
V
DRM
Peak Repetitive Off State Forward Voltage
I
DRM
Peak Forward Blocking Current
V
RRM
Peak Repetitive Off State Reverse Voltage
I
RRM
Peak Reverse Blocking Current
V
TM
Peak On State Voltage
I
H
Holding Current
Voltage Current Characteristic of SCR
Anode +
on state
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode −
Forward Blocking Region
I
RRM
at V
RRM
(off state)
180°
120°
120°
90°
Figure 1. Typical RMS Current Derating Figure 2. On−State Power Dissipation
Figure 3. Typical On−State Characteristics Figure 4. Typical Gate Trigger Current versus
Junction Temperature
80
I
T(RMS)
, RMS ON−STATE CURRENT (AMPS)
110
I
T(AV)
, AVERAGE ON−STATE CURRENT (AMPS)
380
3
0
3.50.5
V
T
, INSTANTANEOUS ON−STATE VOLTAGE (VOLTS)
100
10
1
0.1
T
J
, JUNCTION TEMPERATURE (°C)
−10−40
100
10
0
2.5
T
C
, CASE TEMPERATURE ( C)
P
I
GATE TRIGGER CURRENT ( A)
105
95
123 12
6
15
1.0 2.0 20 50 80 110
°
, AVERAGE POWER DISSIPATION (WATTS)
(AV)
, INSTANTANEOUS ON−STATE CURRENT (AMPS)
T
dc
90°
60°
dc
30°
TYPICAL @ T
J
= 25°C
MAXIMUM @ T
J
= 110°C
5
1.5
45
80
4
75
85
67
9
67
30°
12
5356595
−25
20
30
40
50
60
70
80
90
m
180°
60°
3.0
MAXIMUM @ T
J
= 25°C
90
100

MCR8SD

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
SCRs 400V 8A
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet