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TC1263-3.3VAT

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
TC1263
DS21374D-page 10 2002-2012 Microchip Technology Inc.
5-Lead Plastic (ET) (DDPAK)
BOTTOM VIEW
TOP VIEW
E
D
b
E1
D2
A
A1
c2
c L
D1
e
θ1
θ
(5X)
L3
1
§ Significant Characteristic
Drawing No. C04-012
Notes:
Mold Draft Angle
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
θ1
7°
Pitch
Number of Pins
Overall Width
Standoff §
Molded Package Length
Exposed Pad Width
Overall Height
MAX
Units
Dimension Limits
A1
E1
D
E
e
A
.398
.000
.256 REF
INCHES*
.067 BSC
MIN
5
NOM
MAX
.010 0.00
10.11
6.50 REF
MILLIMETERS
.183
MIN
5
1.70 BSC
NOM
0.25
4.65
JEDEC equivalent: TO-252
4.50.170
.005 0.13
Foot Length L .068 .089 .110 1.73 2.26 2.79
Foot Angle
θ
-- -- 8°
.177
*Controlling Parameter
4.32
.385 .410 9.78 10.41
.330 .350 .370 8.38 8.89 9.40
Overall Length
D1
.549 .577 .605 13.94 14.66 15.37
Lead Thickness
c
.014 .020 .026 0.36 0.51 0.66
Pad Thickness
c2
.045 -- .055 1.14 -- 1.40
Lead Width .037
b
.026 .032 0.66 0.81 0.94
3° --
8°
7°3°
--
--
--
Exposed Pad Length
D2
.303 REF 7.75 REF
Pad Length
L3
.045 -- .067 1.14 -- 1.70
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS21374D-page 11
TC1263
5-Lead Plastic Transistor Outline (AT) (TO-220)
L H1
Q
E
b
e1
e
C1
J1
F
A
D
a
(5X)
ØP
EJECTOR PIN
e3
Drawing No. C04-036
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-220
*Controlling Parameter
Mold Draft Angle
Lead Width
Lead Thickness
a
C1
b
.014
Dimension Limits
Overall Height
Lead Length
Overall Width
Lead Pitch
A
L
E
.540
MIN
e
Units
.060
INCHES*
.022 0.36 0.56
MILLIMETERS
.190
.560 13.72
MINMAX
4.83
14.22
MAX
.160 4.06
3° 7° 3° 7°
Overall Length D
1.020.64.040.025
Overall Lead Centers e1 .263
.385
.560
.273 6.68 6.93
.072 1.52 1.83
.415 9.78 10.54
.590 14.22 14.99
Through Hole Diameter P .146 .156 3.71 3.96
J1Base to Bottom of Lead .090 2.29.115 2.92
Through Hole Center
Q
.103 2.87.113 2.62
Flag Thickness F .045 1.40.055 1.14
Flag Length H1 .234 6.55.258 5.94
Space Between Leads e3 .030 1.02.040 0.76
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TC1263
DS21374D-page 12 2002-2012 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil Body (SOIC)
Foot Angle
048048
1512015120
Mold Draft Angle Bottom
1512015120
Mold Draft Angle Top
0.510.420.33.020.017.013BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length
0.510.380.25.020.015.010hChamfer Distance
5.004.904.80.197.193.189DOverall Length
3.993.913.71.157.154.146E1Molded Package Width
6.206.025.79.244.237.228EOverall Width
0.250.180.10.010.007.004A1Standoff §
1.551.421.32.061.056.052A2Molded Package Thickness
1.751.551.35.069.061.053AOverall Height
1.27.050
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
c
45
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

TC1263-3.3VAT

Mfr. #:
Buy TC1263-3.3VAT
Manufacturer:
Microchip Technology
Description:
LDO Voltage Regulators 500mA Fixed Out Adj
Lifecycle:
New from this manufacturer.
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