TC1263
DS21374D-page 2 2002-2012 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage .........................................................6.5V
Output Voltage................ (GND
– 0.3V) to (V
IN
+ 0.3V)
Power Dissipation................Internally Limited (Note 7)
Voltage (max.) on Any Pin: (GND
– 0.3V) to (V
IN
+ 0.3V)
Operating Temperature Range....-40°C < T
J
< +125°C
Storage Temperature..........................-65°C to +150°C
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V
IN
= V
R
+ 1.0V, (Note 1), I
L
= 100 µA, C
L
= 3.3 µF,
SHDN
> V
IH
, T
A
= +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Input Operating Voltage V
IN
2.7 — 6.0 V Note 2
Maximum Output Current I
OUTMAX
500 ——mA
Output Voltage V
OUT
V
R
– 2.5% V
R
± 0.5% V
R
+ 2.5% V Note 1
V
OUT
Temperature Coefficient V
OUT
/T — 40 — ppm/°C Note 3
Line Regulation V
OUT
/V
IN
—0.050.35 %(V
R
+ 1V) V
IN
6V
Load Regulation (Note 4) V
OUT
/V
OUT
–0.01 0.002 +0.01 %/mA I
L
= 0.1 mA to I
OUTMAX
Dropout Voltage (Note 5) V
IN
-V
OUT
—2030 mV I
L
= 100 µA
—60130 I
L
= 100 mA
— 200 390 I
L
= 300 mA
— 350 650 I
L
= 500 mA
Supply Current I
DD
—80130 µA SHDN = V
IH
, I
L
= 0
Shutdown Supply Current I
SHDN
—0.051 µA SHDN = 0V
Power Supply Rejection Ratio PSRR — 64 — db F 1kHz
Output Short Circuit Current I
OUTSC
— 1200 1400 mA V
OUT
= 0V
Thermal Regulation V
OUT
/P
D
—0.04—V/WNote 6
Output Noise eN — 260 — nV/Hz
I
L
= I
OUTMAX
, F = 10 kHZ
Note 1: V
R
is the regulator output voltage setting.
2: The minimum V
IN
has to justify the conditions: V
IN
V
R
+ V
DROPOUT
and V
IN
2.7V for I
L
= 0.1 mA to I
OUTMAX
.
3:
4: Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.0V differential.
6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to I
LMAX
at V
IN
= 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for
more details.
TCV
OUT
V
OUTM AX
V
OUTM IN
–10
6
–
V
OUT
T
-------------------------------------------------------------------------
=
