MC7900 Series
http://onsemi.com
15
PACKAGE DIMENSIONS
D
PAK
D2T SUFFIX
CASE 936−03
ISSUE D
5 REF5 REF
V
U
TERMINAL 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. TAB CONTOUR OPTIONAL WITHIN
DIMENSIONS A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH OR GATE PROTRUSIONS. MOLD
FLASH AND GATE PROTRUSIONS NOT TO
EXCEED 0.025 (0.635) MAXIMUM.
6. SINGLE GAUGE DESIGN WILL BE SHIPPED
AFTER FPCN EXPIRATION IN OCTOBER 2011.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.386 0.403 9.804 10.236
INCHES
B 0.356 0.368 9.042 9.347
C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
E 0.045 0.055 1.143 1.397
F 0.051 REF 1.295 REF
G 0.100 BSC 2.540 BSC
H 0.539 0.579 13.691 14.707
J 0.125 MAX 3.175 MAX
K 0.050 REF 1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R
S 0.116 REF 2.946 REF
U 0.200 MIN 5.080 MIN
V 0.250 MIN 6.350 MIN
__
A
12 3
K
F
B
J
S
H
D
M
0.010 (0.254) T
E
OPTIONAL
CHAMFER
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.380
5.080
DIMENSIONS: MILLIMETERS
PITCH
2X
16.155
1.016
2X
10.490
3.504
BOTTOM VIEW
OPTIONAL CONSTRUCTIONS
TOP VIEW
SIDE VIEW
DUAL GAUGE
BOTTOM VIEW
L
T
P
R
DETAIL C
SEATING
PLANE
2X
G
N
M
CONSTRUCTION
D
C
DETAIL C
E
OPTIONAL
CHAMFER
SIDE VIEW
SINGLE GAUGE
CONSTRUCTION
S
C
DETAIL C
TT
D
E 0.018 0.026 0.457 0.660
S
