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LTC6244HVCDD#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26
LTC6244
22
6244fb
Figure 11b. Input Referred Noise
Figure 11a. Low Noise AC Difference Amplifi er
(Bandwidth 800Hz to 160kHz, Gain = 10)
V
OUT
= GAIN • V2 – V1
()
+ V
REF
GAIN =
R2
R1
R3 = R1, R4 = R2, C1= C2
BANDWIDTH = f
HI
–f
LO
f
HI
=
1
2•π •R2•C1
, f
LO
=
1
2•π •R5•C3
APPLICATIONS INFORMATION
R5
200k
V
+
R2
20k
R4
20k
C2
47pF
R3
2k
V2
V1
V
OUT
V
REF
6244 F11a
R1
2k
C1
47pF
C3
1000pF
–
+
1/2 LTC6244
–
+
1/2 LTC6244
28
24
20
16
12
8
110
FREQUENCY (kHz)
6244 F11b
1000
4
0
INPUT REFERRED NOISE (nV/√Hz)
BW = 800Hz TO 160kHz
GAIN = 10
LTC6244
23
6244fb
PACKAGE DESCRIPTION
0.25 ± 0.05
2.38 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 ±0.05
(2 SIDES)
2.10 ±0.05
0.50
BSC
0.70 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
2.38 ±0.10
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25 ± 0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
LTC6244
24
6244fb
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
MSOP (MS8) 0307 REV F
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016 ± 0.0508
(.004 ± .002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
± 0.152
(.193 ± .006)
8
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P26

LTC6244HVCDD#PBF

Mfr. #:
Buy LTC6244HVCDD#PBF
Manufacturer:
Analog Devices Inc.
Description:
Precision Amplifiers 2x 50MHz, L N, R2R, CMOS Op Amp
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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