Sheet No.: D2-A01801EN
10
11
10
10
10
9
10
6
10
8
10
7
10
5
10
4
Collector dark current I
CEO
(A)
V
CE
=10V
10
12
200406080100
Ambient temperature T
a
(˚C)
30
Fig.11 Collector Dark Current vs. Ambient
Temperature
100
0
50
150
2505075100
Relative current transfer ratio (%)
Ambient temperature T
a
(˚C)
30
I
F
=1mA
V
CE
=2V
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
Collector-emitter saturation voltage V
CE(sat)
(V)
2505075100
Ambient temperature T
a
(˚C)
30
I
F
=1mA
I
C
=2mA
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
7
0
0.1
Current transfer ratio CTR(%)
400
800
600
200
0.2 0.5 1 2 5 10
Forward current I
F
(mA)
V
CE
=2V
T
a
=25˚C
2 000
1 800
1 600
1 400
1 200
1 000
Fig.7 Current Transfer Ratio vs. Forward
Current
0
012345
10
20
30
40
50
60
70
80
90
100
5mA
2mA
1mA
Collector current I
C
(mA)
Collector-emitter voltage V
CE
(V)
T
a
=25˚C
I
F
=10mA
P
C
(MAX.)
Fig.8 Collector Current vs. Collector-emitter
Voltage
PC3Q65 Series
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Forward current I
F
(mA)
0
0
2
4
6
8
1.0 2.0 3.0 4.0
1mA
3mA
7
5
3
1
3.52.51.50.5
5mA
7mA
30mA
50mA
Collector-emitter Saturation Voltage
V
CE (sat)
(V)
I
C
=0.5mA
T
a
=25˚C
Fig.12 Collector-emitter Saturation Voltage
vs. Forward Current
Sheet No.: D2-A01801EN
Design Considerations
While operating at I
F
<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
Recommended Foot Print (reference)
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
8
1.5
1.27
0.8
6.3
(Unit : mm)
Design guide
PC3Q65 Series
Sheet No.: D2-A01801EN
Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 260˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
9
1234
300
200
100
0
0
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC3Q65 Series

PC3Q65

Mfr. #:
Manufacturer:
Sharp Microelectronics
Description:
OPTOISOLTR 2.5KV 4CH DARL 16SOIC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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