NTP75N03−06, NTB75N03−06
http://onsemi.com
2
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating Symbol Value Unit
Drain−to−Source Voltage V
DSS
30 Vdc
Drain−to−Gate Voltage (RGS = 10 MW)
V
DGB
30 Vdc
Gate−to−Source Voltage − Continuous V
GS
±20 Vdc
Non−repetitive (tp ≤ 10 ms) V
GS
±24 Vdc
Drain Current
− Continuous @ T
C
= 25°C
− Continuous @ T
C
= 100°C
− Single Pulse (tp ≤ 10 ms)
I
D
I
D
I
DM
75
59
225
Adc
Apk
Total Power Dissipation @ T
C
= 25°C
Derate above 25°C
Total Power Dissipation @ T
A
= 25°C (Note 1)
P
D
125
1.0
2.5
W
W/°C
W
Operating and Storage Temperature Range T
J
and T
stg
−55 to 150 °C
Single Pulse Drain−to−Source Avalanche Energy − Starting T
J
= 25°C
(V
DD
= 38 Vdc, V
GS
= 10 Vdc, L = 1 mH, I
L
(pk) = 55 A, V
DS
= 40 Vdc)
E
AS
1500 mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 1)
R
q
JC
R
q
JA
R
q
JA
1.0
62.5
50
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8 in from case for 10 seconds T
L
260 °C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended pad size.
ORDERING INFORMATION
Device Package Shipping
†
NTP75N03−06 TO−220 50 Units / Rail
NTP75N03−06G TO−220
(Pb−Free)
50 Units / Rail
NTB75N03−06
D
2
PAK
50 Units / Rail
NTB75N03−06G
D
2
PAK
(Pb−Free)
50 Units / Rail
NTB75N03−06T4
D
2
PAK
800 Units / Tape & Reel
NTB75N03−06T4G
D
2
PAK
(Pb−Free)
800 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
