Z-Power LED X10490Z-Power LED X10490
Technical Data Sheet
Document No. : SSC-QP-7-07-24 (Rev.00)
Rev. 03
Rev. 03
September 2008
September 2008
www.ZLED.com
www.ZLED.com
10
1. Reflow Soldering Conditions / Profile
2. Hand Soldering conditions
Lead : Not more than 3 seconds @MAX280℃
Slug : Use a thermal-adhesives
* Caution
1. Reflow soldering should not be done more than one time.
2. Repairing should not be done after the LEDs have been soldered. When
repairing is unavoidable, suitable tools have to be used.
3. Die slug is to be soldered.
4. When soldering, do not put stress on the LEDs during heating.
5. After soldering, do not warp the circuit board.
6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.
Soldering profile
Pre-heating
200
180
150
~
0
220
240
260
Rising
5 °C/sec
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (min)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Cooling
-5 °C/sec
Time
[Hr]
