LTC2931
15
2931fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
F Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1650)
F20 TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50**
(.169 – .177)
134
5
6
7
8 910
111214 13
6.40 – 6.60*
(.252 – .260)
20 19 18 17 16 15
1.10
(.0433)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
6.40
(.252)
BSC
0.19 – 0.30
(.0075 – .0118)
TYP
2
MILLIMETERS
(INCHES)
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
*
**
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
RECOMMENDED SOLDER PAD LAYOUT
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
