TSOP753.., TSOP755..
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Vishay Semiconductors
Rev. 1.5, 22-Jul-16
4
Document Number: 82495
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
Fig. 9 - Sensitivity vs. Ambient Temperature
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
Fig. 11 - Horizontal Directivity
Fig. 12 - Vertical Directivity
Fig. 13 - Sensitivity vs. Supply Voltage
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 20 40 60 80 100 120
Burst Length (number of cycles/burst)
Max. Envelope Duty Cycle
22183
f = 38 kHz, E
e
= 2 mW/m²
TSOP755..
TSOP753..
0
0.05
0.10
0.15
0.20
0.25
0.30
-30 -10 10 30 50 70 90
E
e min.
- Threshold Irradiance (mW/m
2
)
T
amb
- Ambient Temperature (°C)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
750 800 850 900 950 1000 1050 1100 1150
21425 λ- Wavelength (nm)
S (λ)
rel
- Relative Spectral Sensitivity
0.8
0.9
1.0
0.6 0.4 0.2 0
30°
10° 20°
40°
50°
60°
70°
80°
d
rel
- Relative Transmission Distance
21427
0.8
0.9
1.0
30°
10° 20°
40°
50°
60°
70°
80°
d
rel
- Relative Transmission Distance
21428
0.6 0.4 0.2 0
0.00
0.05
0.10
0.15
0.20
0.25
0.30
1 2 3 4 5
E
e min.
- Sensitivity (mW/m
2
)
V
S
- Supply Voltage (V)
TSOP753.., TSOP755..
www.vishay.com
Vishay Semiconductors
Rev. 1.5, 22-Jul-16
5
Document Number: 82495
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
SUITABLE DATA FORMAT
The TSOP753.., TSOP755.. series are designed to suppress
spurious output pulses due to noise or disturbance signals.
Data and disturbance signals can be distinguished by the
devices according to carrier frequency, burst length and
envelope duty cycle. The data signal should be close to the
band-pass center frequency (e.g. 38 kHz) and fulfill the
conditions in the table below.
When a data signal is applied to the TSOP753.. and
TSOP755.. in the presence of a disturbance signal, the
sensitivity of the receiver is reduced to insure that no
spurious pulses are present at the output. Some examples
of disturbance signals which are suppressed are:
DC light (e.g. from tungsten bulb or sunlight)
Continuous signals at any frequency
Strongly or weakly modulated pattern from fluorescent
lamps with electronic ballasts (see Fig. 14 or Fig. 15)
Fig. 14 - IR Disturbance from Fluorescent Lamp
with Low Modulation
Fig. 15 - IR Disturbance from Fluorescent Lamp
with High Modulation
Note
For data formats with long bursts please see the datasheet for TSOP752.., TSOP754..
0101520
Time (ms)
16920
IR Signal
5
0101520
Time (ms)
16921
IR Signal
5
TSOP753.. TSOP755..
Minimum burst length 6 cycles/burst 6 cycles/burst
After each burst of length
a minimum gap time is required of
6 to 35 cycles
10 cycles
6 to 24 cycles
10 cycles
For bursts greater than
a minimum gap time in the data stream is
needed of
35 cycles
> 4 x burst length
24 cycles
> 25 ms
Maximum number of continuous short
bursts/second
2000 2000
MCIR code Preferred Yes
RCMM code Preferred Yes
XMP-1, XMP-2 code Preferred Yes
Suppression of interference from fluorescent
lamps
Mild and complex disturbance
patterns are suppressed (example:
signal pattern of Fig. 14 and Fig. 15)
Critical disturbance
patterns are suppressed,
e.g. highly dimmed LCDs
TSOP753.., TSOP755..
www.vishay.com
Vishay Semiconductors
Rev. 1.5, 22-Jul-16
6
Document Number: 82495
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260
°C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
Finish soldering within 3 s
Handle products only after the temperature has cooled off
6.6 ± 0.1
3.2
1.27
3 x 1.27 = 3.81
(4 x)
2.2
(1)
1.2 ± 0.2
(2.2)
2.2
(3.4)
(R1.3)
2.5
0.5 ± 0.1
0.8
(1.8)
3
Pick and place area
Proposed pad layout
from component side
(for reference only)
technical drawings
according to DIN
specications
Not indicated tolerances ± 0.15
Drawing-No.: 6.550-5297.01-4
Issue: 4; 13.09.11
Marking area
Tool separation line
(0.635)
(1.65)
0.8
1.8
1.27
3 x 1.27 = 3.81
(3 x)
Mold residue
Mold residue
6.8
22608

TSOP75536TR

Mfr. #:
Manufacturer:
Description:
Infrared Receivers IR sensor IC 36kHz
Lifecycle:
New from this manufacturer.
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